Patents by Inventor Kim Pritchard

Kim Pritchard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Protecting resin-encapsulated components
    Patent number: 7125429
    Abstract: A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the capacitor element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.
    Type: Grant
    Filed: January 19, 2004
    Date of Patent: October 24, 2006
    Assignee: Kemet Electronics Corporation
    Inventors: Brian John Melody, John Tony Kinard, Daniel F. Persico, Chris Stolarski, Phillip Michael Lessner, Qingping Chen, Kim Pritchard, Albert Kennedy Harrington, David Alexander Wheeler
  • Protecting resin-encapsulated components
    Patent number: 6845004
    Abstract: A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the capacitor element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.
    Type: Grant
    Filed: February 12, 2003
    Date of Patent: January 18, 2005
    Assignee: Kemet Electronics Corporation
    Inventors: Brian John Melody, John Tony Kinard, Daniel F. Persico, Chris Stolarski, Phillip Michael Lessner, Qingping Chen, Kim Pritchard, Albert Kennedy Harrington, David Alexander Wheeler
  • Protecting resin-encapsulated components
    Patent number: 6798645
    Abstract: A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: September 28, 2004
    Assignee: Kemet Electronics Corp.
    Inventors: Brian John Melody, John Tony Kinard, Daniel F. Persico, Chris Stolarski, Phillip Michael Lessner, Qingping Chen, Kim Pritchard, Albert Kennedy Harrington, David Alexander Wheeler
  • Protecting resin-encapsulated components
    Publication number: 20040154149
    Abstract: A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the capacitor element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.
    Type: Application
    Filed: January 19, 2004
    Publication date: August 12, 2004
    Inventors: Brian John Melody, John Tony Kinard, Daniel F. Persico, Chris Stolarski, Phillip Michael Lessner, Qingping Chen, Kim Pritchard, Albert Kennedy Harrington, David Alexander Wheeler
  • PROTECTING RESIN-ENCAPSULATED COMPONENTS
    Publication number: 20040156165
    Abstract: A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the capacitor element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.
    Type: Application
    Filed: January 16, 2004
    Publication date: August 12, 2004
    Inventors: Brian John Melody, John Tony Kinard, Daniel F. Persico, Chris Stolarski, Phillip Michael Lessner, Qingping Chen, Kim Pritchard, Albert Kennedy Harrington, David Alexander Wheeler
  • Protecting resin-encapsulated components
    Publication number: 20040157400
    Abstract: A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the capacitor element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.
    Type: Application
    Filed: February 12, 2003
    Publication date: August 12, 2004
    Inventors: Brian John Melody, John Tony Kinard, Daniel F. Persico, Chris Stolarski, Phillip Michael Lessner, Qingping Chen, Kim Pritchard, Albert Kennedy Harrington, David Alexander Wheeler