Abstract: A method and apparatus for detecting substrate misalignment (i.e., position displacement error) and/or substrate support misalignment. According to certain aspects, a method for detecting a misalignment of an object in a processing system is provided. The method generally includes obtaining a first image of the object, determining first values associated with pixels in at least one region of the first image, calculating at least one of a center of gravity value of the pixels in the at least one region or an average weight of the pixels in the at least one region, and detecting a misalignment of the object based on at least one of the calculated center of gravity or average weight of the pixels in the at least one region.

Abstract: A method and apparatus for detecting substrate misalignment (i.e., position displacement error) and/or substrate support misalignment. According to certain aspects, a method for detecting a misalignment of an object in a processing system is provided. The method generally includes obtaining a first image of the object, determining first values associated with pixels in at least one region of the first image, calculating at least one of a center of gravity value of the pixels in the at least one region or an average weight of the pixels in the at least one region, and detecting a misalignment of the object based on at least one of the calculated center of gravity or average weight of the pixels in the at least one region.

Abstract: A device for heating a semiconductor wafer comprises a heating element arranged to conduct heat toward the wafer. The heating element can extend along a heating element path. An RTD sensor loop can extend along an RTD sensor path. The RTD sensor path can be positioned along the heating element path to measure a temperature that corresponds to the heating element. The RTD sensor loop can measure an average temperature along the heating element. Portions of the RTD sensor can be interlaced between portions of the heating element. The heating element path can be arranged with interstices between portions of the heating element path, and portions of the RTD sensor path can be positioned within the interstices to interlace the RTD sensor loop with the heating element. The RTD sensor loop can comprise a soft metal that is resistant to oxidation and extends along the RTD sensor path.