Abstract: A jacket for an elongated assembly is disclosed. The jacket, which may be a tubular shape or sheet, comprises a film layer to surround a core member of the elongated assembly, wherein the film layer has a first surface to be arranged abutting the core member in a non-bonded relationship; a braided, woven, or warp-knit layer comprising high-melt filament having a titer from 30 to 800 denier; and a bonding region between the braided, woven, or warp-knit layer and a second surface of the film layer, opposing to the first surface, to adhere at least a portion of the high-melt fibers. The jacket may further comprise an inner film layer in a non-bonded relationship with the film layer.

Abstract: A dispensing system may be provided. The dispensing system may comprise a control architecture internal to the dispensing system. The dispensing system may further comprise an internal portion internal to the dispensing system. The internal portion may be configured to provide an internal ingredient under the control of the control architecture. An external portion may be external to the dispensing system. The external portion may be configured to provide an external ingredient to the dispensing system. The external portion may be under the control of the control architecture.

Abstract: A jacket for an elongated assembly is disclosed. The jacket, which may be a tubular shape or sheet, comprises a film layer to surround a core member of the elongated assembly, wherein the film layer has a first surface to be arranged abutting the core member in a non-bonded relationship; a braided, woven, or warp-knit layer comprising high-melt filament having a titer from 30 to 800 denier; and a bonding region between the braided, woven, or warp-knit layer and a second surface of the film layer, opposing to the first surface, to adhere at least a portion of the high-melt fibers. The jacket may further comprise an inner film layer in a non-bonded relationship with the film layer.

Abstract: A dispensing system may be provided. The dispensing system may comprise a control architecture internal to the dispensing system. The dispensing system may further comprise an internal portion internal to the dispensing system. The internal portion may be configured to provide an internal ingredient under the control of the control architecture. An external portion may be external to the dispensing system. The external portion may be configured to provide an external ingredient to the dispensing system. The external portion may be under the control of the control architecture.

Abstract: A method and apparatus for testing and/or burning-in electronic devices such as capacitors is disclosed. The devices are loaded in a matrix having a multiplicity of apertures. A second matrix having complemental apertures is provided, the apertures of the second matrix being filled with fuses. The matrices are pressed together by yieldable electrodes which are connected with a source of current.

Abstract: The present invention relates to a low cost method of fabricating capacitors within tight tolerance ranges. The method involves forming, by vapor deposition or the like, discrete electrode areas on an insulating substrate, and depositing a dielectric layer over the substrate and the areas between the electrodes. A further series of electrode are formed over the dielectric in partial registry with the first mentioned electrodes, and the substrate is thereafter diced to expose opposed edge portions of the resultant capacitors. The capacitors are terminated preferably by a sputtering technique, the sputtered material being insulated from contact with the edge portions of non-exposed electrodes by the deposited dielectric.

Abstract: A desiccant for semiconductor packaging which may be applied in liquid form consists essentially of approximately 60% by weight absolute ethyl alcohol, 25% by weight ethyl acetate, 5% by weight water, 5% by weight a source of boron, aluminum or phosphorus and 5% by weight of an organic silane having the structural formula: ##STR1## where R.sub.1 is a radical selected from the group consisting of H.sup.-, CH.sub.2 .dbd.CH.sup.-, CH.sub.3 O.sup.-, C.sub.2 H.sub.5 O.sup.-, CH.sub.3 CO.sub.2 .sup.-, C.sub.2 H.sub.5 CO.sup.-, and C.sub.3 H.sub.7 O.sup.-, and R is a radical selected from the group consisting of CH.sub.3 O.sup.-, C.sub.2 H.sub.5 O.sup.-, C.sub.3 H.sub.7 O.sup.-, CH.sub.3 CO.sub.2.sup.-, C.sub.2 H.sub.5 CO.sub.2.sup.-, Si.sup.+, OH.sup.-, and O.sup.-. The sources of boron, aluminum, and phosphorus may be halides, oxides or nitrates. Also a process for incorporating the foregoing into semiconductor package and process for formulating the above solution.

Abstract: Non-linear resistors for use as protective devices in electronic circuits. Compositions and methods are disclosed which enable the fabrication of non-linear resistors compatible with other electronic devices in monolithic form. The non-linear resistors disclosed also offer improvements over prior art devices as discrete components.