Abstract: A packaged integrated circuit (IC) device includes a first set of stacked die having a first IC die, a first inductor in the first IC die, an isolation layer over the first IC die, a second IC die over the isolation layer, and a second inductor in the second IC die aligned to communicate with the first inductor, and a second set of stacked die having a third IC die, a third inductor in the third IC die, a second isolation layer over the third IC die, a fourth IC die over the second isolation layer, and a fourth inductor in the fourth IC die aligned to communicate with the third inductor. The isolation layer extends a prespecified distance beyond a first edge of the second IC die, and the second isolation layer extends a second prespecified distance beyond a first edge of the fourth IC die.

Abstract: A packaged integrated circuit (IC) device includes a first set of stacked die having a first IC die, a first inductor in the first IC die, an isolation layer over the first IC die, a second IC die over the isolation layer, and a second inductor in the second IC die aligned to communicate with the first inductor, and a second set of stacked die having a third IC die, a third inductor in the third IC die, a second isolation layer over the third IC die, a fourth IC die over the second isolation layer, and a fourth inductor in the fourth IC die aligned to communicate with the third inductor. The isolation layer extends a prespecified distance beyond a first edge of the second IC die, and the second isolation layer extends a second prespecified distance beyond a first edge of the fourth IC die.

Abstract: A power semiconductor device (10) and a method for increasing the turn-on time of the power semiconductor device (10). The power semiconductor device (10) has a first stage (13) and a second stage (14), where the transconductance of the first stage (13) is less than the transconductance of the second stage (14). The turn-on time of the power semiconductor device (10) is increased by turning on the first stage (13) before turning on the second stage (14).

Abstract: An automobile airbag system for protecting human occupants of an automobile during an accident is provided. An airbag assembly comprises an airbag inflator assembly (45), an airbag (40), and a remote module (41). The remote module (41) includes a capacitor (42) and an integrated circuit (43) for coupling current through a squib (44) to ignite pyrotechnic material (46). The remote module (41) is formed as a plug which connects to the airbag (45) to simplify manufacture. Capacitor (42) provides energy to the squib (44) and switches for forming a conductive path that couples the current through the squib (44). The wiring between the integrated circuit (43) and the squib (44) is less than 3.0 centimeters to reduce electromagnetic radiation pick up.