Abstract: The present disclosure relates generally to compounds that bind to and act as degraders of an IKAROS Family Zinc Finger (IKZF) protein, such as IKZF2 (Helios) and/or IKZF4 (Eos). The disclosure further relates to the use of the compounds for the preparation of a medicament for the treatment of diseases and/or conditions through binding and degradation of an IKZF protein, such as IKZF2 and/or IKZF4, including cancer.

Abstract: Provided is a method for encryption key generation and authentication, based on a gait characteristic. In the method for encryption key generation and authentication, based on a gait characteristic, gait data for the gait of a user is received from a user terminal, a user encryption key for each user is generated with respect to each service, based on the gait data, authentication encryption key is generated based on gait data to be authenticated, the user encryption key is compared with the authentication encryption key, the user is authenticated, when the user encryption key matches the authentication encryption key.

Abstract: A transcatheter heart valve prosthesis and a method of assembling the transcatheter heart valve prosthesis are disclosed. The heart valve prosthesis includes a valve-skirt assembly having an inner skirt, a frame, an outer wrap backing and an outer wrap. The method includes: tacking the valve-skirt assembly within the frame; attaching the inner skirt below commissure posts of the frame; attaching commissures of the valve component to the commissure posts; attaching a plurality of outer wrap backings to the inner skirt; attaching the outer wrap backings and the inner skirt to the frame; attaching tissue bumpers to struts in an outflow section of the frame; attaching an outer wrap and the inner skirt to the frame; attaching the outer wrap to the inner skirt proximate inflow edges thereof; and attaching the outer wrap to the inner skirt and to the outer wrap backings proximate respective outflow edges thereof.

Abstract: Disclosed herein are modified human interleukin-2 (hIL-2) proteins, human antibody molecules, or antigen-binding fragments thereof, that immunospecifically bind to human programmed cell death protein-1 (hPD-1), and immunoconjugates comprising the same.

Abstract: An interposer sandwich structure includes a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes an attachment for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.

Abstract: The invention provides a method for continuously producing composite nanoparticles, the method comprising heating a precursor mixture with supercritical water, wherein the mixture contains a first compound capable of transitioning from a monoclinic to a tetragonal rutile crystal state; cooling the heated mixture to obtain core particles of a predetermined shape and size; encapsulating the core particle with a second precursor to create a core-shell construct; and encapsulating the construct with an organic material. Also provided is a device for continuously synthesizing composite nanoparticles, the device comprising a water supply and a precursor supply; a means for heating the water, a continuous flow hydrothermal reaction chamber adapted to receive the heated water and precursor, a means for chilling the heated water and precursor, and a capping agent supply positioned downstream of the reaction chamber.

Abstract: An interposer sandwich structure includes a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes an attachment for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.

Abstract: Techniques disclosed herein manage and resolve incidents in hybridity manager applications, without the back-and-forth manual steps of the traditional software support lifecycle. In one embodiment, a virtual network operations center (NOC) with a centralized view of distributed, cross-cloud hybridity manager installations is responsible for tracking incident reports relating to hybridity managers and associated bugs, and the virtual NOC automatically publishes notifications of upgrade builds that fix the tracked bugs to the appropriate hybridity managers. When the same bug is encountered again with another hybridity manager instance, the virtual NOC may also publish an upgrade notification to the other hybridity manager instance, without requiring a support ticket to be filed, etc.

Abstract: Techniques are disclosed for cross-cloud hybrid services upgradability. In one embodiment, a virtual network operations center (NOC) with a centralized view of distributed, cross-cloud hybridity manager installations is responsible for continuously gathering information on the environments of on-premise and cloud computing systems, analyzing the gathered information to identify upgrades to hybridity manager instances that are compatible with dependent components and paired hybridity manager(s), and publishing notifications of compatible upgrades to the hybridity manager instances based on the analysis. The publishing of upgrade notifications by the virtual NOC is a server-initiated upgrade that is coordinated across hybrid cloud computing system sites, in contrast to traditional isolated client-initiated upgrades. In addition, the virtual NOC may revoke previous notifications if the associated upgrade versions are no longer compatible with the dependent components and/or the paired hybridity managers.

Abstract: A interposer sandwich structure comprises a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes means for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.