Patents by Inventor Kimberley A. Smedley

Kimberley A. Smedley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Field-configurable optical network terminal device
    Patent number: 8254779
    Abstract: Described herein are systems and methods for a field-configurable optical network terminal (ONT) device at a subscriber to provide one or more communication services to the subscriber. The field-configurable ONT device is of a modular design operable for the insertion of additional communication modules or removal of existing communication modules from the ONT device for scaling the device to increased or decreased communication capacity as desired.
    Type: Grant
    Filed: August 9, 2007
    Date of Patent: August 28, 2012
    Assignee: General Instrument Corporation
    Inventors: William A. Carleton, Jinwoo Lee, Charles F. Niesley, Frank J. Scullin, Kimberley A. Smedley
  • Field-Configurable Optical Network Terminal Device
    Publication number: 20090041467
    Abstract: Described herein are systems and methods for a field-configurable optical network terminal (ONT) device at a subscriber to provide one or more communication services to the subscriber. The field-configurable ONT device is of a modular design operable for the insertion of additional communication modules or removal of existing communication modules from the ONT device for scaling the device to increased or decreased communication capacity as desired.
    Type: Application
    Filed: August 9, 2007
    Publication date: February 12, 2009
    Applicant: GENERAL INSTRUMENT CORPORATION
    Inventors: William A. Carleton, Jinwoo Lee, Charles F. Niesley, Frank J. Scullin, Kimberley A. Smedley
  • Nested plug-in modules
    Patent number: 6700797
    Abstract: A modular electronic chassis system with nested electronic plug-in modules including at least one circuit board providing a first-module-receiving-location and a second-module-receiving-location such that the system is capable of supporting modules in a nested configuration having increased packaging density. A first plug-in module detachably engaged with the first-module-receiving-location. A second plug-in module detachably engaged with the second-module-receiving-location so that the first plug-in module and the second plug-in module are nested.
    Type: Grant
    Filed: October 17, 2001
    Date of Patent: March 2, 2004
    Assignee: General Instrument Corporation
    Inventors: Steven F. Frederick, Kimberley A. Smedley, Ronald L. Gebhardt, Jr., Douglas A. Tenney
  • Nested plug-in modules
    Publication number: 20020131249
    Abstract: A modular electronic chassis system with nested electronic plug-in modules including at least one circuit board providing a first-module-receiving-location and a second-module-receiving-location such that the system is capable of supporting modules in a nested configuration having increased packaging density. A first plug-in module detachably engaged with the first-module-receiving-location. A second plug-in module detachably engaged with the second-module-receiving-location so that the first plug-in module and the second plug-in module are nested.
    Type: Application
    Filed: May 13, 2002
    Publication date: September 19, 2002
    Applicant: General Instrument Corporation
    Inventors: Steven F. Frederick, Kimberley A. Smedley, Ronald L. Gebhardt, Douglas A. Tenney
  • Nested plug-in modules
    Publication number: 20020064034
    Abstract: A modular electronic chassis system with nested electronic plug-in modules including at least one circuit board providing a first-module-receiving-location and a second-module-receiving-location such that the system is capable of supporting modules in a nested configuration having increased packaging density. A first plug-in module detachably engaged with the first-module-receiving-location. A second plug-in module detachably engaged with the second-module-receiving-location so that the first plug-in module and the second plug-in module are nested.
    Type: Application
    Filed: October 17, 2001
    Publication date: May 30, 2002
    Applicant: General Instrument Corporation
    Inventors: Steven F. Frederick, Kimberley A. Smedley, Ronald L. Gebhardt, Douglas A. Tenney