Patents by Inventor Kimberly D. Eilert

Kimberly D. Eilert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package using array capacitor core
    Patent number: 7692284
    Abstract: An embodiment of the present invention is a technique to fabricate a package substrate. The package substrate includes top substrate layers, an array capacitor, and bottom substrate layers. The top substrate layers embed micro-vias. The micro-vias have a micro-via area and provide electrical connections between the top substrate layers. The array capacitor structure is placed in contact with the micro-via area. The array capacitor structure is electrically connected to the micro-vias. The bottom substrate layers are formed on the array capacitor structure.
    Type: Grant
    Filed: December 12, 2005
    Date of Patent: April 6, 2010
    Assignee: Intel Corporation
    Inventors: Kimberly D. Eilert, Kaladhar Radhakrishnan, Kemal Aygun, Michael J. Hill
  • Controlled equivalent series resistance capacitor
    Patent number: 7361969
    Abstract: Some embodiments of the present invention include capacitors with controlled equivalent series resistance.
    Type: Grant
    Filed: July 8, 2005
    Date of Patent: April 22, 2008
    Assignee: Intel Corporation
    Inventors: Michael J. Hill, Kemal Aygun, Kimberly D. Eilert, Kaladhar Radhakrishnan