Abstract: A wire plating cell comprises an enclosed housing into which plating solution is pumped at a high velocity so as to create substantial fluid pressure therein. The plating cell contains a plurality of consumable anodes through which a wire passes axially and through which plating solution flows transversely. Current densities of at least 200 amps per square foot are obtained. Use of a highly concentrated plating solution in the cell results in high-speed, high quality wire plating. The invention particularly applies to the plating of nickel onto steel wire at current densities of up to 14,500 amps per square foot.

Abstract: A wire plating cell comprises an enclosed housing into which plating solution is pumped at a high velocity so as to create substantial fluid pressure therein. The plating cell contains a plurality of consumable anodes through which a wire passes axially and through which plating solution flows transversely. Current densities of at least 200 amps per square foot are obtained. Use of a highly concentrated plating solution in the cell results in high-speed, high quality wire plating. The invention particularly applies to the plating of nickel onto steel wire at current densities of up to 14,500 amps per square foot.

Abstract: A bath for electrodeposition of nickel onto a steel wire substrate from a nickel fluoborate solution. The bath is pumped to a substantial pressure in a specialized high speed, high current density continuous wire plating cell. The bath has a high concentration of nickel ions and a low pH and is operated at very high current densities and elevated temperatures to achieve a good quality nickel plate deposition at a rate far exceeding that of prior art baths. The invention particularly applies to the plating of nickel onto steel wire at current densities of up to 14,500 amps per square foot.