Patents by Inventor Kimchau N. Nguyen

Kimchau N. Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10591671
    Abstract: Some embodiments of the present disclosure describe an apparatus for III/V-Si taper coupling, including a III/V-Si taper coupler with one end to receive a laser beam where the one end has at least one surface at a non-perpendicular angle with respect to a direction of the laser beam, and where the at least one surface forms one or more tips at the one end of the III/V-Si taper coupler. The one end is positioned so that the one or more tips are outside the laser beam to reduce reflection of laser beam away from the one end of the III/V-Si taper coupler.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: March 17, 2020
    Assignee: Intel Corporation
    Inventors: Wenhua Lin, Kimchau N. Nguyen
  • Publication number: 20190137688
    Abstract: Some embodiments of the present disclosure describe an apparatus for III/V-Si taper coupling, including a III/V-Si taper coupler with one end to receive a laser beam where the one end has at least one surface at a non-perpendicular angle with respect to a direction of the laser beam, and where the at least one surface forms one or more tips at the one end of the III/V-Si taper coupler. The one end is positioned so that the one or more tips are outside the laser beam to reduce reflection of laser beam away from the one end of the III/V-Si taper coupler.
    Type: Application
    Filed: December 28, 2018
    Publication date: May 9, 2019
    Inventors: Wenhua Lin, Kimchau N. Nguyen
  • Publication number: 20180059446
    Abstract: Apparatuses, methods and storage medium associated with an optical iso-modulator are disclosed herein. In embodiments, an apparatus may include an optical waveguide formed on one or more layers, such as an isolation layer and a handling layer. A modulator driver may be coupled to a first side of the one or more layers. A magneto-optical (MO) die may be coupled to a second side of the one or more layers that is opposite the first side. Other embodiments may be disclosed and/or claimed.
    Type: Application
    Filed: August 29, 2016
    Publication date: March 1, 2018
    Inventors: Woosung Kim, John Heck, Haisheng Rong, Jeffrey B. Driscoll, Kimchau N. Nguyen