Patents by Inventor Kimcuc T. Tran

Kimcuc T. Tran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same
    Patent number: 5508228
    Abstract: Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.
    Type: Grant
    Filed: February 14, 1994
    Date of Patent: April 16, 1996
    Assignee: Microelectronics and Computer Technology Corporation
    Inventors: Ernest R. Nolan, Diana C. Duane, Todd H. Herder, Thomas A. Bishop, Kimcuc T. Tran, Robert W. Froehlich, Randy L. German, Richard D. Nelson, Chung J. Lee, Mark R. Breen, Kathryn V. Keswick
  • Method for producing conductive patterns
    Patent number: 5358604
    Abstract: The invention provides an apparatus and methods of using the apparatus to transfer conductive patterns onto substrates under conditions of heat and pressure. The apparatus comprises a master mold with a printing surface on which is produced a permanent mirror image of the conductive pattern to be created. This pattern is then coated with a loosely adherent film of conductive metal, such as copper, which is transferred onto a substrate to be printed.
    Type: Grant
    Filed: September 29, 1992
    Date of Patent: October 25, 1994
    Assignee: Microelectronics and Computer Technology Corp.
    Inventors: Charles W. C. Lin, Chung J. Lee, Tom J. Hirsch, Kimcuc T. Tran