Patents by Inventor Kimiaki Iwaya

Kimiaki Iwaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11128190
    Abstract: A winding electric wire enables a space factor to be increased and an eddy current to be suppressed, despite using an easy winding process. A winding electric wire is configured such that one enameled wire or a plurality of enameled wires bundled in parallel or in a litz form are braided so as to be formed into a belt-like rectangular or square wire shape having flat braided wires forming flatly-molded layers the number that is two or a multiple of two.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: September 21, 2021
    Assignee: MEIKO ELECTRONICS CO., LTD.
    Inventors: Kimiaki Iwaya, Yuki Kaketa
  • Publication number: 20190296596
    Abstract: A winding electric wire enables a space factor to be increased and an eddy current to be suppressed, despite using an easy winding process. A winding electric wire is configured such that one enameled wire or a plurality of enameled wires bundled in parallel or in a litz form are braided so as to be formed into a belt-like rectangular or square wire shape having flat braided wires forming flatly-molded layers the number that is two or a multiple of two.
    Type: Application
    Filed: November 30, 2017
    Publication date: September 26, 2019
    Inventors: Kimiaki IWAYA, Yuki KAKETA
  • Patent number: 8471669
    Abstract: In a disc-type coil that enables assuring a sufficiently high value of a flowing current to increase an output and comprises: a discoid insulating substrate 1; a conductor pattern 2 that is provided on each of both surfaces of the insulating substrate 1 so that through hole lands 22 and 23 are position on the outer circumferential side and the inner circumferential side of the insulating substrate 1, and that is arranged to be alternately folded back on both the surfaces of the insulating substrate 1; and through holes that are formed in the insulating substrate 1 and connect the through hole lands 22 and 23 of the conductor pattern 2, the plurality of through holes 6 are aligned and arranged in a radial direction c in each through hole land 23 on the inner circumferential side.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: June 25, 2013
    Assignee: Cosmo Mechanics Co., Ltd.
    Inventor: Kimiaki Iwaya
  • Patent number: 8319595
    Abstract: Disc-type coil lamination work is facilitated, and a manufacturing cost is reduced. A plurality of disc-type coils each including a discoid insulating substrate 1, conductor patterns 2 arranged on the insulating substrate 1, and holes 7 configured to form lamination through holes 10 bored in the insulating substrate 1 are laminated by connecting the lamination through holes 10. The holes 7 configured to form the lamination through holes 10 are provided on the outer circumferential side or the inner circumferential side of the conductor patterns 2, and a leading pattern 3 and a terminating pattern 4 serving as terminal portions of each conductor pattern 2 are drawn to the holes 7 and connected, thereby forming the lamination through holes 10.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: November 27, 2012
    Assignee: Cosmo Mechanics Co., Ltd.
    Inventor: Kimiaki Iwaya
  • Publication number: 20120133474
    Abstract: In a disc-type coil that enables assuring a sufficiently high value of a flowing current to increase an output and comprises: a discoid insulating substrate 1; a conductor pattern 2 that is provided on each of both surfaces of the insulating substrate 1 so that through hole lands 22 and 23 are position on the outer circumferential side and the inner circumferential side of the insulating substrate 1, and that is arranged to be alternately folded back on both the surfaces of the insulating substrate 1; and through holes that are formed in the insulating substrate 1 and connect the through hole lands 22 and 23 of the conductor pattern 2, the plurality of through holes 6 are aligned and arranged in a radial direction c in each through hole land 23 on the inner circumferential side.
    Type: Application
    Filed: December 22, 2009
    Publication date: May 31, 2012
    Inventor: Kimiaki Iwaya
  • Publication number: 20120126927
    Abstract: Disc-type coil lamination work is facilitated, and a manufacturing cost is reduced. A plurality of disc-type coils each including a discoid insulating substrate 1, conductor patterns 2 arranged on the insulating substrate 1, and holes 7 configured to form lamination through holes 10 bored in the insulating substrate 1 are laminated by connecting the lamination through holes 10. The holes 7 configured to form the lamination through holes 10 are provided on the outer circumferential side or the inner circumferential side of the conductor patterns 2, and a leading pattern 3 and a terminating pattern 4 serving as terminal portions of each conductor pattern 2 are drawn to the holes 7 and connected, thereby forming the lamination through holes 10.
    Type: Application
    Filed: January 13, 2010
    Publication date: May 24, 2012
    Inventor: Kimiaki Iwaya