Abstract: A semiconductor chip includes a plurality of pads; input/output circuits connected with the plurality of pads, respectively; a product data storage section configured to store a product data; and a setting section configured to set to an active state, each of the input circuits which is connected to one of the plurality of pads used for input to an internal circuit, and each of the output circuits which is connected to one of the plurality of pads used for output from the internal circuit, and set remaining input/output circuits to an inactive state, based on the product data.

Abstract: A semiconductor chip is composed of first and second contact pads; a first latch circuit connected with the first contact pad; a second latch circuit connected with the second contact pads; an internal circuit electrically connected with the first and second latch circuits; and a control circuit controlling data transfer between the first and second latch circuits. The area of the first contact pad is larger than that of the second contact pad.

Abstract: A semiconductor circuit is installed on a printed circuit board having a power wiring pattern and a ground wiring pattern that do not intersect. The semiconductor circuit includes a first power supply terminal and a first ground terminal for a first side of the semiconductor circuit, and a second power supply terminal and a second ground terminal for a second side opposing to the first side. The direction from the first power supply terminal to the first ground terminal is the same as the direction from the second power supply terminal to the second ground terminal.

Abstract: A semiconductor chip includes a plurality of pads; input/output circuits connected with the plurality of pads, respectively; a product data storage section configured to store a product data; and a setting section configured to set to an active state, each of the input circuits which is connected to one of the plurality of pads used for input to an internal circuit, and each of the output circuits which is connected to one of the plurality of pads used for output from the internal circuit, and set remaining input/output circuits to an inactive state, based on the product data.

Abstract: A semiconductor chip includes a plurality of pads; input/output circuits connected with the plurality of pads, respectively; a product data storage section configured to store a product data; and a setting section configured to set to an active state, each of the input circuits which is connected to one of the plurality of pads used for input to an internal circuit, and each of the output circuits which is connected to one of the plurality of pads used for output from the internal circuit, and set remaining input/output circuits to an inactive state, based on the product data.

Abstract: A microcomputer includes a circuit block; a nonvolatile memory configured to store optimization data for optimization of an operation of the microcomputer; and an optimization circuit configured to read out memory optimization data as a part of the optimization data from the nonvolatile memory in synchronization with a first frequency clock signal as an first clock signal to optimize an operation of the nonvolatile memory, and then to read out circuit block optimization data as another part of the optimization data from the nonvolatile memory in synchronization with a second frequency clock signal as the first clock signal to optimize an operation of the circuit block. The frequency of the first frequency clock signal is lower than that of the second frequency clock signal.

Abstract: A semiconductor circuit is installed on a printed circuit board having a first wiring pattern and a second wiring pattern. The semiconductor circuit includes a first power supply terminal and a first ground terminal which are provided for a first side of the semiconductor circuit. The first power supply terminal is connected with the first wiring pattern. The first ground terminal is connected with the second wiring pattern. A second power supply terminal and a second ground terminal are provided for a second side opposing to the first side. The second power supply terminal is connected with the first wiring pattern and the second ground terminal is connected with the second wiring pattern. The first and second power and ground terminals are arranged such that the first wiring pattern and the second wiring pattern do not intersect in a region of the wiring substrate corresponding to the semiconductor circuit.

Abstract: A semiconductor chip includes a plurality of pads; input/output circuits connected with the plurality of pads, respectively; a product data storage section configured to store a product data; and a setting section configured to set to an active state, each of the input circuits which is connected to one of the plurality of pads used for input to an internal circuit, and each of the output circuits which is connected to one of the plurality of pads used for output from the internal circuit, and set remaining input/output circuits to an inactive state, based on the product data.

Abstract: A microcomputer includes a circuit block; a nonvolatile memory configured to store optimization data for optimization of an operation of the microcomputer; and an optimization circuit configured to read out memory optimization data as a part of the optimization data from the nonvolatile memory in synchronization with a first frequency clock signal as an first clock signal to optimize an operation of the nonvolatile memory, and then to read out circuit block optimization data as another part of the optimization data from the nonvolatile memory in synchronization with a second frequency clock signal as the first clock signal to optimize an operation of the circuit block. The frequency of the first frequency clock signal is lower than that of the second frequency clock signal.

Abstract: A semiconductor chip is composed of first and second contact pads; a first latch circuit connected with the first contact pad; a second latch circuit connected with the second contact pads; an internal circuit electrically connected with the first and second latch circuits; and a control circuit controlling data transfer between the first and second latch circuits. The area of the first contact pad is larger than that of the second contact pad.