Abstract: An energy application device applies optical energy on an adhesion sheet by a light radiator and, subsequently, applies heat energy on the adhesion sheet by a heater. With this arrangement, even the adhesion sheet, which includes an adhesive layer having an energy barrier that cannot be overcome only with optical energy, is enabled to start a photoreaction by overcoming an energy barrier with the heat energy from the heater.

Abstract: An energy application device applies optical energy on an adhesion sheet by a light radiator and, subsequently, applies heat energy on the adhesion sheet by a heater. With this arrangement, even the adhesion sheet, which includes an adhesive layer having an energy barrier that cannot be overcome only with optical energy, is enabled to start a photoreaction by overcoming an energy barrier with the heat energy from the heater.

Abstract: A UV irradiating portion 12 is provided with multiple UV light emitting diodes 21 arranged on a base plate 20 which is in a position corresponding to a semiconductor wafer attached with a protective sheet S through a UV curable adhesive layer 18 as an irradiation receiving body. The light emitting diodes 21 are arranged at intervals of substantially equal spaces along the direction substantially perpendicular to the relative movement direction with a wafer W. And, the light emitting diodes 21 in each row are arranged to have substantially the same peak wavelength, while the peak wavelengths of the light emitting diodes 21 in the adjacent rows are arranged to be not necessarily the same.

Abstract: A semiconductor wafer is taken as an object to be irradiated, to which a protection sheet S is stuck via an ultraviolet cured adhesive layer, and an ultraviolet irradiation part 12 is disposed facing the protection sheet S, the ultraviolet irradiation part 12 being provided with a plurality of the ultraviolet light-emitting diodes 21 disposed on the substrate 20. The light-emitting diodes 21 are arranged to be spaced equally from each other on the straight lines L1 of plural rows substantially perpendicular to a relative movement direction to the wafer, and between the neighboring light-emitting diodes in each row, a part of the light-emitting diode of the neighboring row is positioned.

Abstract: A protecting sheet applied to a wafer is removed by using an adhesive tape with a prescribed length, by bonding the adhesive tape to an edge portion of the protecting sheet and then pulling the adhesive tape. During pulling, a guide roller is held in contact with the protecting sheet and, while the guide roller is held in a fixed position, a peeling head portion and a table are moved in the opposite direction with each other to thereby remove the protecting sheet.

Abstract: A protecting sheet applied to a wafer is removed by using an adhesive tape with a prescribed length, by bonding the adhesive tape to an edge portion of the protecting sheet and then pulling the adhesive tape. During pulling, a guide roller is held in contact with the protecting sheet and, while the guide roller is held in a fixed position, a peeling head portion and a table are moved in the opposite direction with each other to thereby remove the protecting sheet.