Abstract: Provided is a resin composition comprising (A) an epoxy compound, (B) an epoxy resin, and (C) a photocationic polymerization initiator. Preferably, this resin composition has a moisture content of 1000 ppm or less and a chlorine content of 1000 ppm or less. This resin composition is an energy beam-curable resin composition having accurate coating properties, excellent adhesiveness, low moisture permeability, excellent adhesive durability, and excellent storage stability.

Abstract: Provided is a resin composition comprising (A) an epoxy compound, (B) an epoxy resin, and (C) a photocationic polymerization initiator. Preferably, this resin composition has a moisture content of 1000 ppm or less and a chlorine content of 1000 ppm or less. This resin composition is an energy beam-curable resin composition having accurate coating properties, excellent adhesiveness, low moisture permeability, excellent adhesive durability, and excellent storage stability.

Abstract: Provided is a curable composition which contains: an organic peroxide encapsulated in microcapsules which further contains a plasticizer; an accelerator which reacts with the organic peroxide to accelerate polymerization; (meth)acrylate compounds which may contain a (meth)acrylate having a carboxylic group and a (meth)acrylate having an alicyclic hydrocarbon; and a multifunctional (meth)acrylate different from the (meth)acrylate having a carboxylic group. The curable composition exhibits a quick curing rate.

Abstract: A two-part type adhesive composition which comprises a first composition comprising (A) a nitrile butadiene rubber having an acrylonitrile content of from 10 to 30%, (B) a polymerizable (meth)acrylic liquid composition, (C) an organic peroxide and (D) a basic compound having an amine structure, and a second composition comprising (E) a reaction condensate of an amine and an aldehyde and (F) a reducing agent containing copper, is provided. In a preferred embodiment, the first composition also contains a photopolymerization initiator. A bonding method using the adhesive composition provides high adhesion and quick curing properties on the second time scale, and a high retention in durability on a high temperature and high humidity test.

Abstract: Disclosed is an adhesive composition having adhesion properties, high-speed curing properties and moisture resistance. Also disclosed is an adhesion method. Specifically disclosed is a composition which comprises: a first preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (C) a compound having an enal structure, and (F) a radical polymerization initiator; and a second preparation comprising (A) the nitrile-butadiene rubber, (B) the (meth)acrylic composition, (D) a compound having an amine structure, and (E) a compound containing copper. Also disclosed is a composition which comprises: a first preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (D) a compound having an amine structure, and (F) a radical polymerization initiator; and a second preparation comprising (A) the nitrile-butadiene rubber, (B) the (meth)acrylic composition, (C) a compound having an enal structure, and (E) a compound containing copper.

Abstract: A curable composition and an adhesive which exhibit a temporarily fixing effect very quickly and which are completely cured quickly at room temperature, and a bonding method using such a composition. The curable composition including a component (A)], which is a polymerizable acrylic liquid composition, a component (B), which is cumene hydroperoxide, a component (C), which is a reducing agent containing vanadium or copper, or a reducing agent comprising ethylene thiourea, and a component (D), which is a basic compound having a primary, secondary, or tertiary amine structure.

Abstract: Disclosed is an adhesive composition having adhesion properties, high-speed curing properties and moisture resistance. Also disclosed is an adhesion method. Specifically disclosed is a composition which comprises: a first preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (C) a compound having an enal structure, and (F) a radical polymerization initiator; and a second preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (D) a compound having an amine structure, and (E) a compound containing copper. Also disclosed is a composition which comprises: a first preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (D) a compound having an amine structure, and (F) a radical polymerization initiator; and a second preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (C) a compound having an enal structure, and (E) a compound containing copper.

Abstract: To provide a curable composition which is quickly cured, with which objects to be bonded can be sufficiently bonded even if gaps are formed between the objects, if the size of the gaps is at a level of at most 100 ?m. A curable composition which comprises at least one organic peroxide, an accelerator which reacts with the organic peroxide to accelerate polymerization of monomers, a monofunctional (meth)acrylate and a multifunctional (meth)acrylate, wherein the organic peroxide is encapsulated in microcapsules. Preferably the above curable composition, wherein the monofunctional (meth)acrylate contains a (meth)acrylate having a carboxylic group and a (meth)acrylate having an alicyclic hydrocarbon.

Abstract: An energy ray-curable resin composition comprising (A) a (meth)acrylate having a molecular weight of from 500 to 5,000, of which the main chain backbone is at least one member selected from the group consisting of a polybutadiene, a polyisoprene and hydrogenated products thereof and which has at least one (meth)acryloyl group at an end of the main chain backbone or in a side chain, (B) a monofunctional (meth)acrylate having a C2-8 unsaturated hydrocarbon group via an ester bond, (C) a hydroxyl group-containing (meth)acrylate, (D) a polyfunctional (meth)acrylate, (E) a photopolymerization initiator, and (F) an antioxidant which exhibits equally high adhesive strength to various objects to be bonded, has good heat and moisture resistance, excellent rigidity, low cure shrinkage and little adhesion strain is provided.

Abstract: To provide an adhesive composition having high adhesion and quick curing properties on the second time scale, and having a high retention in a durability test such as a high temperature and high humidity test. A two-part type adhesive composition which comprises a first agent comprising (A) a nitrile butadiene rubber having an acrylonitrile content of from 10 to 30%, (B) a polymerizable (meth)acrylic liquid composition, (C) an organic peroxide and (D) a basic compound having an amine structure, and a second agent comprising (E) a reaction condensate of an amine and an aldehyde and (F) a reducing agent containing copper, preferably, an adhesive composition wherein the first agent contains a photopolymerization initiator, and a bonding method using it.

Abstract: To provide a primer composition for assisting an acrylic adhesive which exhibits a temporarily fixing effect very quickly and which is completely cured quickly at room temperature, while maintaining excellent characteristics of the acrylic adhesive. A primer composition, which comprises a component (A): a basic compound having a primary, secondary or tertiary amine structure, a component (B): a liquid oligomer, and a component (C): a solvent. Preferably, the component (A) is a compound having a main chain of which the skeleton is ethyleneimine, or ethyleneimine having a molecular weight of from 50 to 70,000. Further, a bonding method, which comprises applying the above primer composition on a surface of an object to be bonded by dot coating, and bonding the object to another object to be bonded by means of the acrylic adhesive.

Abstract: To provide a curable composition and an adhesive which exhibit a temporarily fixing effect very quickly and which are completely cured quickly at room temperature, and a bonding method. A curable composition comprising a component (A): a polymerizable acrylic liquid composition, a component (B): cumene hydroperoxide, a component (C): a reducing agent containing vanadium or copper or a reducing agent comprising ethylene thiourea, and a component (D): a basic compound having a primary, secondary or tertiary amine structure, and a bonding method using it.

Abstract: To provide an energy ray-curable resin composition which exhibits equally high adhesive strength to various objects to be bonded, such as glasses, metals and plastics and which has good heat resistance and moisture resistance and is excellent also in rigidity, particularly an energy ray-curable resin composition having a low cure shrinkage and little adhesion strain. An energy ray-curable resin composition comprising (A) a (meth)acrylate having a molecular weight of from 500 to 5,000, of which the main chain backbone is at least one member selected from the group consisting of a polybutadiene, a polyisoprene and hydrogenated products thereof and which has at least one (meth)acryloyl group at an end of the main chain backbone or in a side chain, (B) a monofunctional (meth)acrylate having a C2-8 unsaturated hydrocarbon group via an ester bond, (C) a hydroxyl group-containing (meth)acrylate, (D) a polyfunctional (meth)acrylate, (E) a photopolymerization initiator, and (F) an antioxidant.