Abstract: The adhesive tape of the present disclosure includes: a substrate; and an adhesive layer disposed on one surface of the substrate. In the adhesive tape of the present disclosure, when a breakdown voltage in a thickness direction of the adhesive tape is represented as X (unit: kV) and an initial elastic modulus evaluated from a stress-strain curve in a tensile test is represented as Y (unit: N/mm), an inequality Y ? 4.5X -22.5 is satisfied. The adhesive tape of the present disclosure has an excellent balance between insulating properties and winding properties in winding work.

Abstract: A heat-resistant release sheet includes a heat-resistant release sheet to be disposed between a compression bonding target and a thermocompression head at the time of thermocompression-bonding the compression bonding target by the thermocompression head to prevent fixation between the compression bonding target and the thermocompression head, wherein surface hardness, as expressed in an indentation degree A300 given by an equation A300 (%)=(d300/t0)×100, of the heat-resistant release sheet at 300° C. is 15% or less, where to is a thickness of the heat-resistant release sheet at ordinary temperature (20° C.) and d300 is an indentation depth evaluated for the heat-resistant release sheet at 300° C.

Abstract: A heat-resistant release sheet of the present disclosure is a sheet formed of a single-layer heat-resistant resin film having a thickness of 35 pm or less, wherein the sheet is disposed between a compression bonding target and a thermocompression head at the time of thermocompression-bonding the compression bonding target by the thermocompression head to prevent fixation between the compression bonding target and the thermocompression head, and a heat-resistant resin forming the heat-resistant resin film has a melting point of 310° C. or higher and/or a glass transition temperature of 210° C. or higher. A use temperature of this heat-resistant release sheet can be, for example, 250° C. or higher. The heat-resistant release sheet of the present disclosure can more reliably meet a demand for an increase in thermocompression bonding temperature.