Patents by Inventor Kimihiro Ashino
Kimihiro Ashino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11835415Abstract: A sensor device for measuring a physical quantity. The sensor device includes a sensor element having a semiconductor chip, a first terminal electrically connected to the sensor element, and a housing portion having a terminal, which is a second terminal and is electrically connected to the first terminal. The second terminal has a through-hole formed therein, the through-hole having a first end and a second end opposite to each other, an inner surface of the through hole at the first end being an R-surface that is a curved surface with a radius R. The first terminal is housed in the housing portion, and has one end thereof inserted in the through-hole from the first end of the through-hole.Type: GrantFiled: December 29, 2021Date of Patent: December 5, 2023Assignee: FUJI ELECTRIC CO., LTD.Inventor: Kimihiro Ashino
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Publication number: 20220364945Abstract: Provided is a pressure sensor apparatus, including: a pressure sensor unit; a case configured to house the pressure sensor unit; and a plurality of lead terminals configured to be exposed toward outside of of the case, wherein the plurality of lead terminals include a first terminal, a second terminal, and a ground terminal; and the ground terminal, the first terminal and the second terminal are arranged in an order of the ground terminal, the first terminal, and the second terminal outside the case. The pressure sensor apparatus includes a capacitor for a second terminal arranged across the ground terminal and the second terminal in between in interior of the case.Type: ApplicationFiled: April 26, 2022Publication date: November 17, 2022Inventors: Hiroto KIKUCHI, Kazuhiro MATSUNAMI, Kimihiro ASHINO
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Publication number: 20220260444Abstract: A sensor device for measuring a physical quantity. The sensor device includes a sensor element having a semiconductor chip, a first terminal electrically connected to the sensor element, and a housing portion having a terminal, which is a second terminal and is electrically connected to the first terminal. The second terminal has a through-hole formed therein, the through-hole having a first end and a second end opposite to each other, an inner surface of the through hole at the first end being an R-surface that is a curved surface with a radius R. The first terminal is housed in the housing portion, and has one end thereof inserted in the through-hole from the first end of the through-hole.Type: ApplicationFiled: December 29, 2021Publication date: August 18, 2022Applicant: FUJI ELECTRIC CO., LTD.Inventor: Kimihiro ASHINO
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Publication number: 20220208622Abstract: A semiconductor package includes a flat plate-shaped terminal integrally formed with a housing portion for a semiconductor chip and a rod-shaped terminal pin that penetrates through a through-hole of the plate-shaped terminal. On a surface of the plate-shaped terminal, a resin guide portion for guiding the terminal pin to the through-hole of the plate-shaped terminal is provided. The resin guide portion is a portion of the housing portion and has a through-hole that is continuous with the through-hole of the plate-shaped terminal. During assembly of the semiconductor package, the terminal pin is inserted into the through-hole of the plate-shaped terminal, via the through-hole of the resin guide portion. A sidewall of the through-hole of the resin guide portion and a sidewall of the through-hole of the plate-shaped terminal have a same slope and form a single continuous surface; a border between the through-hole of the resin guide portion and the through-hole of the plate-shaped terminal is free of any step.Type: ApplicationFiled: November 30, 2021Publication date: June 30, 2022Applicant: FUJI ELECTRIC CO., LTD.Inventor: Kimihiro ASHINO
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Patent number: 10651609Abstract: A first connector pin to a third connector pin have a substantially L-shaped cross-sectional shape formed by a horizontal part embedded in the top of an inner housing part by resin molding and a vertical part continuous with and protruding upwardly orthogonal to the horizontal part. A fourth connector pin has a substantially I-shaped cross-sectional shape having only the vertical part. The horizontal part of the first connector pin is provided so as to surround the first end of the first connector pin, the horizontal part and the first end of the second connector pin, the horizontal part and the first end of the third connector pin, and is integrated and connected to the fourth connector pin. A chip capacitor is attached to the connector pins by a joining member. Thus, the connector pins are connected to each other via the chip capacitors.Type: GrantFiled: December 29, 2017Date of Patent: May 12, 2020Assignee: FUJI ELECTRIC CO., LTD.Inventors: Fumiya Ueno, Kimihiro Ashino
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Patent number: 10190929Abstract: Provided are a pressure sensor device and method for making the same. A base member and a pressure sensor chip are joined so that a pressure receiving portion is aligned with a through hole. A pressure introduction unit and the base member are positioned and joined so that through holes thereof are continuous. The pressure introduction unit has a stepped portion in an end portion on an opened end side, and has a protruding portion protruding from the stepped portion to the base member side in an end portion.Type: GrantFiled: August 7, 2015Date of Patent: January 29, 2019Assignee: FUJI ELECTRIC CO., LTD.Inventors: Eisuke Sato, Shigeru Shinoda, Kimihiro Ashino
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Publication number: 20180241160Abstract: A first connector pin to a third connector pin have a substantially L-shaped cross-sectional shape formed by a horizontal part embedded in the top of an inner housing part by resin molding and a vertical part continuous with and protruding upwardly orthogonal to the horizontal part. A fourth connector pin has a substantially I-shaped cross-sectional shape having only the vertical part. The horizontal part of the first connector pin is provided so as to surround the first end of the first connector pin, the horizontal part and the first end of the second connector pin, the horizontal part and the first end of the third connector pin, and is integrated and connected to the fourth connector pin. A chip capacitor is attached to the connector pins by a joining member. Thus, the connector pins are connected to each other via the chip capacitors.Type: ApplicationFiled: December 29, 2017Publication date: August 23, 2018Applicant: FUJI ELECTRIC CO., LTD.Inventors: Fumiya UENO, Kimihiro ASHINO
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Patent number: 9874487Abstract: A pressure sensor includes a socket portion and a nut portion which are integrally molded with resin, a screw portion which is tightly fixed to a side wall of an opening in a concave part of the nut portion by adhesive, and a sense element which is fixed to the screw portion and is disposed in the concave part of the nut portion. The socket portion, the nut portion and the screw portion constitute a package. A through hole introducing the pressure measurement target liquid is formed in the screw portion. An external lead-out terminal is fixed to the sense element. The external lead-out terminal passes through the through hole on a base of the concave part of the nut portion, and is tightly fixed to the socket portion with adhesive. The external lead-out terminal is a connection terminal to be connected with external wiring.Type: GrantFiled: August 5, 2014Date of Patent: January 23, 2018Assignee: FUJI ELECTRIC CO., LTD.Inventor: Kimihiro Ashino
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Patent number: 9733140Abstract: A double diaphragm type pressure sensor includes a metal container having a concave portion; a pressure sensor unit mounted on a bottom of the container; a metal diaphragm airtightly bonded to an opening portion of the concave portion of the container; a pressure transmission medium filling a space formed by the metal diaphragm and the concave portion of the container; and a metal terminal penetrating the bottom of the container and being electrically insulated from the container.Type: GrantFiled: May 11, 2015Date of Patent: August 15, 2017Assignee: FUJI ELECTRIC CO., LTD.Inventor: Kimihiro Ashino
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Publication number: 20160076960Abstract: Provided are a pressure sensor device and method for making the same. A base member and a pressure sensor chip are joined so that a pressure receiving portion is aligned with a through hole. A pressure introduction unit and the base member are positioned and joined so that through holes thereof are continuous. The pressure introduction unit has a stepped portion in an end portion on an opened end side, and has a protruding portion protruding from the stepped portion to the base member side in an end portion.Type: ApplicationFiled: August 7, 2015Publication date: March 17, 2016Applicant: FUJI ELECTRIC CO., LTD.Inventors: Eisuke SATO, Shigeru SHINODA, Kimihiro ASHINO
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Publication number: 20150369680Abstract: A double diaphragm type pressure sensor includes a metal container having a concave portion; a pressure sensor unit mounted on a bottom of the container; a metal diaphragm airtightly bonded to an opening portion of the concave portion of the container; a pressure transmission medium filling a space formed by the metal diaphragm and the concave portion of the container; and a metal terminal penetrating the bottom of the container and being electrically insulated from the container.Type: ApplicationFiled: May 11, 2015Publication date: December 24, 2015Inventor: Kimihiro ASHINO
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Publication number: 20140338448Abstract: A pressure sensor includes a socket portion and a nut portion which are integrally molded with resin, a screw portion which is tightly fixed to a side wall of an opening in a concave part of the nut portion by adhesive, and a sense element which is fixed to the screw portion and is disposed in the concave part of the nut portion. The socket portion, the nut portion and the screw portion constitute a package. A through hole introducing the pressure measurement target liquid is formed in the screw portion. An external lead-out terminal is fixed to the sense element. The external lead-out terminal passes through the through hole on a base of the concave part of the nut portion, and is tightly fixed to the socket portion with adhesive. The external lead-out terminal is a connection terminal to be connected with external wiring.Type: ApplicationFiled: August 5, 2014Publication date: November 20, 2014Inventor: Kimihiro ASHINO
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Patent number: 8683867Abstract: An aspect of a pressure sensor package is that a condensed droplet can be prevented from solidifying and blocking the hole of a pressure inlet pipe, without increasing the external dimensions of the package. Aspects of the invention include a groove in a wall surface of a hole of a pressure inlet pipe, a droplet condensed on the wall surface spreads along the groove by a capillary action, and it is possible to prevent the hole of the pressure inlet pipe being blocked by the droplet.Type: GrantFiled: September 23, 2011Date of Patent: April 1, 2014Assignee: Fuji Electric Co., Ltd.Inventor: Kimihiro Ashino
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Publication number: 20120073381Abstract: An aspect of a pressure sensor package is that a condensed droplet can be prevented from solidifying and blocking the hole of a pressure inlet pipe, without increasing the external dimensions of the package. Aspects of the invention include a groove in a wall surface of a hole of a pressure inlet pipe, a droplet condensed on the wall surface spreads along the groove by a capillary action, and it is possible to prevent the hole of the pressure inlet pipe being blocked by the droplet.Type: ApplicationFiled: September 23, 2011Publication date: March 29, 2012Applicant: FUJI ELECTRIC CO., LTD.Inventor: Kimihiro ASHINO
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Patent number: D669804Type: GrantFiled: May 9, 2012Date of Patent: October 30, 2012Assignee: Fuji Electric Co., Ltd.Inventor: Kimihiro Ashino
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Patent number: D695140Type: GrantFiled: August 15, 2012Date of Patent: December 10, 2013Assignee: Fuji Electric Co., Ltd.Inventor: Kimihiro Ashino
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Patent number: D695141Type: GrantFiled: August 20, 2012Date of Patent: December 10, 2013Assignee: Fuji Electric Co., Ltd.Inventor: Kimihiro Ashino
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Patent number: D695142Type: GrantFiled: August 20, 2012Date of Patent: December 10, 2013Assignee: Fuji Electric Co., Ltd.Inventor: Kimihiro Ashino
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Patent number: D700090Type: GrantFiled: March 11, 2013Date of Patent: February 25, 2014Assignee: Fuji Electric Co., Ltd.Inventor: Kimihiro Ashino
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Patent number: D894767Type: GrantFiled: February 25, 2019Date of Patent: September 1, 2020Assignee: FUJI ELECTRIC CO., LTD.Inventor: Kimihiro Ashino