Patents by Inventor Kimihiro Nakada

Kimihiro Nakada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Carrying method and bonding apparatus
    Patent number: 10239211
    Abstract: A laminate is directly transferred from a first robot arm that carries the laminate from a bonding chamber to an overlapping chamber, to a second robot arm that carries out the laminate from the overlapping chamber to the outside.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: March 26, 2019
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Kimihiro Nakada, Shigeru Kato
  • Method for manufacturing laminate, method for manufacturing sealed substrate laminate, sealed substrate laminate, and sealed substrate
    Patent number: 9837298
    Abstract: A laminate manufactured by forming a step difference in a substrate by grinding a periphery edge portion to have such a size that a surface on the inner side of the step difference can be housed in a cavity of a die, and then laminating the substrate, an adhesive layer, a release layer, and a support plate in this order such that the surface on the inner side of the step difference of the substrate faces the support plate.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: December 5, 2017
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Akihiko Nakamura, Kimihiro Nakada
  • Bonding method
    Patent number: 9682541
    Abstract: A bonding method which includes a pressing step of bonding a substrate and a support plate for supporting the substrate to each other through an adhesive layer and pressing the bonded substrate and support plate using a plate member; and, after the pressing step, a pressure adjusting step of placing the substrate and the support plate bonded to each other through the adhesive layer in an environment having higher pressure than pressure of an environment in which the pressing step is performed.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: June 20, 2017
    Assignee: TOKOY OHKA KOGYO CO., LTD.
    Inventors: Hirofumi Imai, Atsushi Kubo, Takahiro Yoshioka, Kimihiro Nakada, Shigeru Kato, Yasumasa Iwata
  • CARRYING METHOD AND BONDING APPARATUS
    Publication number: 20160158939
    Abstract: A laminate is directly transferred from a first robot arm that carries the laminate from a bonding chamber to an overlapping chamber, to a second robot arm that carries out the laminate from the overlapping chamber to the outside.
    Type: Application
    Filed: November 19, 2015
    Publication date: June 9, 2016
    Inventors: Kimihiro NAKADA, Shigeru KATO
  • METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING SEALED SUBSTRATE LAMINATE, SEALED SUBSTRATE LAMINATE, AND SEALED SUBSTRATE
    Publication number: 20160163579
    Abstract: A laminate manufactured by forming a step difference in a substrate by grinding a periphery edge portion to have such a size that a surface on the inner side of the step difference can be housed in a cavity of a die, and then laminating the substrate, an adhesive layer, a release layer, and a support plate in this order such that the surface on the inner side of the step difference of the substrate faces the support plate.
    Type: Application
    Filed: November 13, 2015
    Publication date: June 9, 2016
    Inventors: Akihiko NAKAMURA, Kimihiro NAKADA
  • BONDING METHOD
    Publication number: 20150165741
    Abstract: A bonding method which includes a pressing step of bonding a substrate and a support plate for supporting the substrate to each other through an adhesive layer and pressing the bonded substrate and support plate using a plate member; and, after the pressing step, a pressure adjusting step of placing the substrate and the support plate bonded to each other through the adhesive layer in an environment having higher pressure than pressure of an environment in which the pressing step is performed.
    Type: Application
    Filed: December 10, 2014
    Publication date: June 18, 2015
    Inventors: Hirofumi Imai, Atsushi Kubo, Takahiro Yoshioka, Kimihiro Nakada, Shigeru Kato, Yasumasa Iwata
  • Stripping device and stripping method
    Patent number: 8377256
    Abstract: A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: February 19, 2013
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Kimihiro Nakada, Yasumasa Iwata, Akihiko Nakamura, Yoshihiro Inao, Satoshi Kobari
  • STRIPPING DEVICE AND STRIPPING METHOD
    Publication number: 20130000852
    Abstract: A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.
    Type: Application
    Filed: September 13, 2012
    Publication date: January 3, 2013
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Kimihiro NAKADA, Yasumasa IWATA, Akihiko NAKAMURA, Yoshihiro INAO, Satoshi KOBARI
  • Stripping device and stripping method
    Patent number: 8302651
    Abstract: A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.
    Type: Grant
    Filed: April 25, 2011
    Date of Patent: November 6, 2012
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Kimihiro Nakada, Yasumasa Iwata, Akihiko Nakamura, Yoshihiro Inao, Satoshi Kobari
  • STRIPPING DEVICE AND STRIPPING METHOD
    Publication number: 20110259527
    Abstract: A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.
    Type: Application
    Filed: April 25, 2011
    Publication date: October 27, 2011
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Kimihiro Nakada, Yasumasa Iwata, Akihiko Nakamura, Yoshihiro Inao, Satoshi Kobari