Patents by Inventor Kimiko Jane Childress

Kimiko Jane Childress has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate with adhesive bonding metallization with diffusion barrier
    Patent number: 7400042
    Abstract: A metallization layer that includes a tantalum layer located on the component, a tantalum silicide layer located on the tantalum layer, and a platinum silicide layer located on the tantalum silicide layer. In another embodiment the invention is a component having a metallization layer on the component. In another embodiment, the metallization layer has a post-annealing adhesive strength to silicon of at least about 100 MPa as measured by a mechanical shear test after exposure to a temperature of about 600° C. for about 30 minutes, and the metallization layer remains structurally intact after exposure to a temperature of about 600° C. for about 1000 hours. The metallization is useful for bonding with brazing alloys.
    Type: Grant
    Filed: May 3, 2005
    Date of Patent: July 15, 2008
    Assignee: Rosemount Aerospace Inc.
    Inventors: Odd Harald Steen Eriksen, Kimiko Jane Childress