Patents by Inventor Kiminari Yamashita

Kiminari Yamashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120300359
    Abstract: A current passing device passes current through bodies. The current passing device includes a first current receiving element having an electrical resistance, a second current receiving element having a contact resistance greater than the electrical resistance of the first current receiving element in a state in which the second current receiving element has been brought into direct contact with the first current receiving element without pressing the second current receiving element, a pressing mechanism arranged to press the first current receiving element and the second current receiving element closer together, and an electrically conductive intervening member disposed between the first current receiving element and the second current receiving element. The intervening member has a degree of deformation greater than degrees of deformation of both the first and second current receiving elements in a case where the intervening member has been pressed due to the pressing mechanism.
    Type: Application
    Filed: February 25, 2011
    Publication date: November 29, 2012
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Kiminari Yamashita, Yukihiro Utaka, Aiko Saitou, Yoshinobu Nagano, Keiichirou Kametani
  • Publication number: 20110230331
    Abstract: An adsorbing molded body is configured to be subjected to ohmic heating or electromagnetic wave heating. The adsorbing molded body includes an electrically conductive powder adsorbent, an insulating powder adsorbent, and an inorganic binder that binds the powder adsorbents together. An adsorption recovery treatment apparatus includes the adsorbing molded body and a heating unit to heat the adsorbing molded body, preferably ohmically or using electromagnetic waves. An adsorbate desorbing method includes desorbing an adsorbate, which the adsorbing molded body has adsorbed, from the adsorbing molded body by heating the adsorbing molded body, preferably ohmically or using electromagnetic waves.
    Type: Application
    Filed: October 19, 2009
    Publication date: September 22, 2011
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Kiminari Yamashita, Yukihiro Utaka, Aiko Saitou, Yoshinobu Nagano, Keiichirou Kametani