Patents by Inventor Kiminobu INAYOSHI

Kiminobu INAYOSHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device for vehicle
    Patent number: 9723731
    Abstract: A vehicular electronic device has a semiconductor package and a multilayer wiring board. An electrode pad of the multilayer wiring board, to which a signal terminal of the semiconductor package is soldered, has a wiring pattern in an inner layer of the multilayer wiring board. A solder resist is applied and spaced from a periphery of the electrode pad to the exterior. The signal terminal is soldered to the electrode pad to cover an upper surface and an upper end of a side surface of the electrode pad. As a result, a crack is less likely to occur in solder connected to the signal terminal. Therefore, the signal terminal can be electrically connected with high reliability even when the signal terminal is provided in the semiconductor package with a small number.
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: August 1, 2017
    Assignee: DENSO CORPORATION
    Inventors: Hiroaki Ando, Kiminobu Inayoshi, Tetsuichi Takeuchi, Naoto Makino, Tetsuya Sueyoshi, Kenichi Katoh, Keisuke Nishio
  • ELECTRONIC DEVICE FOR VEHICLE
    Publication number: 20160066439
    Abstract: A vehicular electronic device has a semiconductor package and a multilayer wiring board. An electrode pad of the multilayer wiring board, to which a signal terminal of the semiconductor package is soldered, has a wiring pattern in an inner layer of the multilayer wiring board. A solder resist is applied and spaced from a periphery of the electrode pad to the exterior. The signal terminal is soldered to the electrode pad to cover an upper surface and an upper end of a side surface of the electrode pad. As a result, a crack is less likely to occur in solder connected to the signal terminal. Therefore, the signal terminal can be electrically connected with high reliability even when the signal terminal is provided in the semiconductor package with a small number.
    Type: Application
    Filed: April 3, 2014
    Publication date: March 3, 2016
    Inventors: Hiroaki ANDO, Kiminobu INAYOSHI, Tetsuichi TAKEUCHI, Naoto MAKINO, Tetsuya SUEYOSHI, Kenichi KATOH, Keisuke NISHIO