Abstract: This substrate includes an insulating substrate having a first surface and a second surface, and a metal layer of a metal plate bonded to the first surface. The insulating substrate has a through hole. The metal layer includes: a bent section that is inserted through the through hole and bulges from the first surface toward the second surface; and outer periphery sections that are positioned around the bent section and are bonded to the first surface. The bent section has a first end and a second end positioned on opposite sides, and is bent with respect to the outer periphery sections at the first end and the second ends. The outer periphery sections are divided into a first outer periphery section and a second outer periphery section, which are respectively continuous with the first end and the second end of the bent section.

Abstract: A substrate includes an insulating substrate, a metal layer formed on one surface of the insulating substrate, and an electronic component soldered to the surface of the metal layer. The metal layer is formed of a metal plate. The surface of the metal layer has a soldering area, and a groove portion positioned on the outer periphery of the soldering area.

Abstract: An electronic component has a main body and an electrode that is provided on the main body and configured to be joined to a circuit board with a conductor. The main body includes a connecting portion, which is configured to be connected to a connecting member, a fitting portion that is allowed to be fitted to a receiving portion provided in the circuit board, and a contacting portion, which is allowed to contact a surface of the circuit board.

Abstract: An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section joined to an electrically insulative board and bent toward the rear surface of the electrically insulative board. The second copper plate has a second bent section which is extended from a second joining section joined to the electrically insulative board, is bent toward the front surface of the electrically insulative board, and is disposed so as to cover, together with the first bent section, the inner wall surface of a base-material through-hole. Through-holes are provided in the portions of the second copper plate which face the inside of the base-material through-hole. Solder is filled between the first bent section and the second bent section.

Abstract: This substrate includes an insulating substrate having a first surface and a second surface, and a metal layer of a metal plate bonded to the first surface. The insulating substrate has a through hole. The metal layer includes: a bent section that is inserted through the through hole and bulges from the first surface toward the second surface; and outer periphery sections that are positioned around the bent section and are bonded to the first surface. The bent section has a first end and a second end positioned on opposite sides, and is bent with respect to the outer periphery sections at the first end and the second ends. The outer periphery sections are divided into a first outer periphery section and a second outer periphery section, which are respectively continuous with the first end and the second end of the bent section.

Abstract: This module includes an insulating substrate having a first surface and a second surface, which are positioned on opposite sides to each other, a first metal layer that is provided on the first surface of the insulating substrate and include a metal plate, a second metal layer provided on the second surface of the insulating substrate, a first circuit board including the insulating substrate, the first metal layer, and the second metal layer, an electronic component joined to the first metal layer, and a positioning portion, which is located on the joint surface between the first metal layer and the electronic component, at which the first metal layer and the electronic component are engaged with each other through a recess-projection relationship. The insulating substrate is located between the second metal layer and a part of the first metal layer where the positioning portion is located.

Abstract: A substrate includes an insulating substrate, a metal layer formed on one surface of the insulating substrate, and an electronic component soldered to the surface of the metal layer. The metal layer is formed of a metal plate. The surface of the metal layer has a soldering area, and a groove portion positioned on the outer periphery of the soldering area.

Abstract: A wiring board includes a first substrate including a first surface and a second substrate including a first surface. A solder hole is arranged at least in the first surface of the first substrate. A solder hole is arranged at least in the first surface of the second substrate. The second substrate is coupled to the first substrate. The first substrate and the second substrate are electrically connected with each other. The first surface of the first substrate and the first surface of the second substrate are flush with each other and configured such that a part of one surface of a mask is placed on the first surface of the first substrate and another part of the surface of the mask is placed on the first surface of the second substrate.

Abstract: A planar coil includes an effective line segment, which extends over at least one turn and is configured such that a current flows therein, and a dummy line segment, which extends over at least one turn and is configured such that a current does not flow therein.

Abstract: This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface.

Abstract: An induction device includes a casing, a coil retainer, a coil that is disposed in the casing and retained to the coil retainer and a core that is disposed in the casing. The coil extends spirally around the core. The core and the coil retainer are fixed to the casing separately.

Abstract: A circuit board, onto which an electronic component is to be mounted, is provided with insulating core substrates and patterned metal plates. The metal plates are bonded to at least one side of the insulating core substrates. The insulating core substrates and the metal plates form a laminated body, in which a gas-vent hole is provided. The gas-vent hole is formed so that when the electronic component is mounted, the gas present between the insulating core substrates and the metal plates expands and is released to a side open to the atmosphere via the gas-vent hole.

Abstract: This multi-layer wiring board is provided with an insulating substrate, an inner layer copper sheet, and an outer layer copper foil. The inner layer copper sheet is disposed within the insulating substrate and has been patterned. The outer layer copper foil is disposed in a state of having been patterned at the surface of the insulating substrate, is thinner than the inner layer copper sheet, and has a cross-sectional area of the current path that is smaller than the cross-sectional area of the current path of the inner layer copper sheet. As a result, provided are: a multi-layer wiring board that can flow a large current and a smaller current while suppressing an increase in the projected area of the substrate; and a method for producing the multi-layer wiring board.

Abstract: An electronic device includes a shielding member, an electric circuit, and a filter capacitor. The electric circuit has an output line and is arranged inside the shielding member. The filter capacitor is arranged outside the shielding member to be connected to the output line.

Abstract: An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section joined to an electrically insulative board and bent toward the rear surface of the electrically insulative board. The second copper plate has a second bent section which is extended from a second joining section joined to the electrically insulative board, is bent toward the front surface of the electrically insulative board, and is disposed so as to cover, together with the first bent section, the inner wall surface of a base-material through-hole. Through-holes are provided in the portions of the second copper plate which face the inside of the base-material through-hole. Solder is filled between the first bent section and the second bent section.

Abstract: This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface.

Abstract: An electronic unit includes a double-sided substrate having an insulation substrate, a patterned first metal plate bonded on one side of the insulation substrate, and a patterned second metal plate bonded on the other side of the insulation substrate, and also includes a heat radiation member for releasing heat from the double-sided substrate. The heat radiation member is disposed adjacent to one of the first metal plate and the second metal plate generating a larger amount of heat than the other of the first metal plate and the second metal plate.

Abstract: A substrate connection structure includes a first substrate, a second substrate, a first connection terminal plate, a second connection terminal plate, and a fastening member. The first connection terminal plate extends away from the first substrate and includes a flat portion. The second connection terminal plate extends away from the second substrate and includes a flat portion. At least one of the flat portions includes a screw insertion portion. The fastening member fastens the first connection terminal plate and the second connection terminal plate through the screw insertion portion in a state in which the flat portions are in contact with each other.

Abstract: An electronic unit includes a double-sided substrate having an insulation substrate, a patterned first metal plate bonded on one side of the insulation substrate, and a patterned second metal plate bonded on the other side of the insulation substrate, and also includes a heat radiation member for releasing heat from the double-sided substrate. The heat radiation member is disposed adjacent to one of the first metal plate and the second metal plate generating a larger amount of heat than the other of the first metal plate and the second metal plate.

Abstract: A substrate connection structure includes a first substrate, a second substrate, a first connection terminal plate, a second connection terminal plate, and a fastening member. The first connection terminal plate extends away from the first substrate and includes a flat portion. The second connection terminal plate extends away from the second substrate and includes a flat portion. At least one of the flat portions includes a screw insertion portion. The fastening member fastens the first connection terminal plate and the second connection terminal plate through the screw insertion portion in a state in which the flat portions are in contact with each other.