Abstract: In a high-frequency module mounting structure according to the present invention, a circuit board includes a reinforcing electrode on the lower surface thereof for increasing a mounting strength of the first and second electrode groups in a state of being in close proximity, a motherboard includes a reinforcing lands corresponding to the reinforcing electrodes in a state of being in close proximity to the lands, and the electrodes and the lands, and the reinforcing electrodes and the reinforcing lands are soldered. Therefore, soldering of the high-frequency module with respect to the motherboard is enhanced, and thus a reliable high-frequency module mounting structure is provided.

Abstract: In a high-frequency module mounting structure according to the present invention, a circuit board includes a reinforcing electrode on the lower surface thereof for increasing a mounting strength of the first and second electrode groups in a state of being in close proximity, a motherboard includes a reinforcing lands corresponding to the reinforcing electrodes in a state of being in close proximity to the lands, and the electrodes and the lands, and the reinforcing electrodes and the reinforcing lands are soldered. Therefore, soldering of the high-frequency module with respect to the motherboard is enhanced, and thus a reliable high-frequency module mounting structure is provided.

Abstract: According to a structure for inspecting the alignment of a mounted electrical component of the present invention, a wiring pattern has fiducial portions extending closely along at least two outer edges of a rectangular electrical component. Accordingly, conventional silk-screen printed markers can be eliminated, resulting in a more productive and less expensive structure for inspecting the alignment of a mounted electrical component.

Abstract: The electronic circuit unit of the present invention is provided with the broad width lands and the thin width lands tied with the broad width lands, which are configured by a solder resist that is formed on the surface of the circuit board. Owing to this configuration, the solders placed on the thin width lands are drawn toward the broad width lands, which increases the quantity of the solder buildup on the broad width lands, and accompanied with this increase, swells the heights of the solder buildup on the broad width lands. Thus, the electronic circuit unit of the present invention ensures the soldering.

Abstract: According to a structure for inspecting the alignment of a mounted electrical component of the present invention, a wiring pattern has fiducial portions extending closely along at least two outer edges of a rectangular electrical component. Accordingly, conventional silk-screen printed markers can be eliminated, resulting in a more productive and less expensive structure for inspecting the alignment of a mounted electrical component.

Abstract: In the electronic device of the present invention, leg portions of a frame are projected downward from the underside of a printed circuit board, so the positioning of the electronic device can be done by inserting the leg portions into holes formed in a mother printed circuit board. Thus, when the electronic device is surface-mounted to the mother board, there is no fear of its dislocation even under vibration or shock. Accordingly, the electronic device is not deteriorated at all in its quality.