Patents by Inventor Kimio Motoda

Kimio Motoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5853812
    Abstract: A method for processing substrates, comprising the steps of (a) disposing a substrate on a supporting table, followed by preparing a nozzle and a contact adjusting member in a waiting position apart from the substrate disposed on the supporting table and further preparing removing means in a position intermediate between the waiting position and an operating position, (b) allowing a solvent to be attached to the contact adjusting member in the waiting position and moving the contact adjusting member relative to the nozzle so as to bring the process solution present in the solution discharge port of the nozzle into contact with the solvent attached to the contact adjusting member and, thus, to adjust the condition of the process solution present in the solution discharge port of the nozzle, (c) moving the nozzle from the waiting position to an operating position through the removing means so as to allow the process solution spurted from the nozzle to be moved into the removing means, and (d) moving the substra
    Type: Grant
    Filed: August 7, 1997
    Date of Patent: December 29, 1998
    Assignee: Tokyo Electron Limited
    Inventors: Tetsu Kawasaki, Kimio Motoda
  • Patent number: 5853803
    Abstract: A method of resist-processing a rectangular substrate including a resist coating step of supplying resist solution to the substrate, while rotating it, to form resist film at least on one surface of it and a resist removing step of jetting removing liquid, which can solve resist, to both surfaces of it at its side peripheral portions to remove the resist film from them.
    Type: Grant
    Filed: November 5, 1997
    Date of Patent: December 29, 1998
    Assignees: Tokyo Electron Limited, Tokyo Electron Kyushu Limited
    Inventors: Kiyohisa Tateyama, Kimio Motoda, Tatsuya Iwasaki, Takenobu Matsuo, Kazuki Denpoh, Eiji Yamaguchi
  • Patent number: 5803970
    Abstract: A method of forming a coating film, in which the coating film is formed by supplying a coating liquid onto a surface of a substrate, while the substrate housed in a processing vessel is rotated together with the processing vessel, includes the steps of coating the surface of the substrate with a solvent, supplying the coating liquid to the substrate, rotating the substrate and the processing vessel at a first rotation speed to diffuse the coating liquid on the surface of the substrate, closing the processing vessel with a lid to seal the substrate in the processing vessel, and rotating the processing vessel with the lid and the substrate at a second rotation speed to uniform a film thickness of the coating film.
    Type: Grant
    Filed: November 29, 1996
    Date of Patent: September 8, 1998
    Assignees: Tokyo Electron Limited, Tokyo Electron Kyuchu Limited
    Inventors: Kiyohisa Tateyama, Kimio Motoda, Kenji Sekiguchi, Tsutae Omori
  • Patent number: 5762708
    Abstract: A coating apparatus comprises a rotary container rotatable about a rotational axis as the center, a rotary rest table, located in the rotary container to be movable vertically and rotatable about the rotational axis as the center, for supporting a target substrate thereon, coating solution supply pipe for applying a coating solution to the target substrate, cleaning solution supply pipe for spraying a cleaning solution to an inner surface of the rotary container, a seal member provided between the rotary rest table and the bottom wall of the rotary container and capable of sealing a gap between the rotary rest table and the bottom wall of the rotary container, and connecting mechanism for connecting the rotary container and the rotary rest table so as to rotate together.
    Type: Grant
    Filed: September 7, 1995
    Date of Patent: June 9, 1998
    Assignee: Tokyo Electron Limited
    Inventors: Kimio Motoda, Kiyohisa Tateyama
  • Patent number: 5718763
    Abstract: A apparatus of resist-processing a rectangular substrate including a resist coating step of supplying resist solution to the substrate, while rotating it, to form resist film at least on one surface of it and a resist removing step of jetting removing liquid, which can solve resist, to both surfaces of it at its side peripheral portions to remove the resist film from them.
    Type: Grant
    Filed: April 4, 1995
    Date of Patent: February 17, 1998
    Assignees: Tokyo Electron Limited, Tokyo Electron Kyushu Limited
    Inventors: Kiyohisa Tateyama, Kimio Motoda, Tatsuya Iwasaki, Takenobu Matsuo, Kazuki Denpoh, Eiji Yamaguchi
  • Patent number: 5695817
    Abstract: A method of forming a coating film, in which the coating film is formed by supplying a coating liquid onto a surface of a substrate, while the substrate housed in a processing vessel is rotated together with the processing vessel, includes the steps of coating the surface of the substrate with a solvent, supplying the coating liquid to the substrate, rotating the substrate and the processing vessel at a first rotation speed to diffuse the coating liquid on the surface of the substrate, closing the processing vessel with a lid to seal the substrate in the processing vessel, and rotating the processing vessel with the lid and the substrate at a second rotation speed to uniform a film thickness of the coating film.
    Type: Grant
    Filed: August 7, 1995
    Date of Patent: December 9, 1997
    Assignees: Tokyo Electron Limited, Tokyo Electron Kyushu Limited
    Inventors: Kiyohisa Tateyama, Kimio Motoda, Kenji Sekiguchi, Tsutae Omori
  • Patent number: 5688322
    Abstract: Disclosed is an apparatus for coating resist comprising a spin-chuck capable of moving vertically, holding a substrate received and rotating together with the substrate, resist solution supplying mean for supplying a resist solution onto a substrate held on the spin-chuck, a rotating cup surrounding the substrate held on the spin-chuck and rotated in synchronism with the spin-chuck, for receiving the resist solution centrifugally separated from the substrate, a drain cup provided around the rotating cup, for receiving a waste material discharged from the rotating cup, the drain cup having a collecting space for collecting the waste material received, a drainage passage having a drainage port opening into the collecting space for discharging a liquid component of the waste material collected in the collecting space therefrom, an exhaust passage having an exhaust port communicating with the collecting space, for discharging a gas component of the waste material collected in the collecting space therefrom, an ex
    Type: Grant
    Filed: May 24, 1996
    Date of Patent: November 18, 1997
    Assignee: Tokyo Electron Limited
    Inventors: Kimio Motoda, Kiyohisa Tateyama, Noriyuki Anai