Abstract: A package for surface-mounted components according to the present invention includes a first board which includes contact portions formed on a front face side thereof for mounting the components to be surface-mounted thereon, and first through-holes electrically contiguous with the contact portions; a second board includes conductor pins provided on a rear face side thereof for establishing continuity with another board and second through-holes electrically contiguous with the conductor pins; and a conductor layer interposed between the first and second boards by which the first through-holes in the first board side and the second through-holes in the second board side are mutually electrically connected.