Abstract: Blended in a liquid epoxy resin composition comprising a liquid epoxy resin and an inorganic filler are a specific imidazole compound as a curing accelerator and an amino group-containing, polyether-modified polysiloxane. The resulting composition is suited as a sealing material for flip-chip type semiconductor devices since it has improved thin-film infiltration and storage stability.

Abstract: A sealing material comprising (A) a liquid epoxy resin, (B) a curing agent, (C) a copolymer obtained through addition reaction between an alkenyl group-containing epoxy resin and an SiH group-containing organopolysiloxane, (D) an inorganic filler having a specific surface area of less than 4 m2/g, and (E) a fine inorganic filler having a specific surface area of at least 4 m2/g and surface treated with an aminosilane or organosilazane compound is suitable for sealing flip-chip type semiconductor devices. Despite high loading of inorganic fillers, the material has a low viscosity in the low shear region and improved thin-film infiltration and forms a reliable seal.

Abstract: In a liquid epoxy resin composition comprising a liquid epoxy resin and an inorganic filler, a specific imidazole compound having a solubility of up to 1% by weight in the epoxy resin, a melting point of at least 170° C., a mean particle diameter of 1-5 &mgr;m, and a maximum particle diameter of up to 20 &mgr;m is used as a curing accelerator. The resulting composition is suited as a sealing material for flip-chip type semiconductor devices since it has improved thin-film infiltration and storage stability.

Abstract: A flip-chip type semiconductor device has a semiconductor chip mounted on a substrate via a plurality of bumps. The gap between the substrate and the chip is filled with an underfill material and sealed along sides thereof with a fillet material. The underfill material is a cured epoxy resin composition comprising a liquid epoxy resin and an inorganic filler, having a coefficient of expansion of 20-40 ppm/° C. below its Tg. The fillet material is a similar cured epoxy resin composition having a coefficient of expansion of less than 20 ppm/° C. below its Tg. The device is highly reliable.

Abstract: Disclosed is a frame-supported pellicle for dust-proofing of a photolithographic photomask used for patteriwse light exposure in the manufacturing process of, for example, semiconductor devices, which comprises (a) a frame member, (b) a transparent polymeric film supported by the frame member and (c) a coating layer of a sticky adhesive on one surface of the polymeric film to capture any dust particles in the space between the photomask and the pellicle. The inventive pellicle is imparted with a greatly improved serviceable life with stability against ultraviolet irradiation relative to the adhesive coating layer which is formed from a specific organo-polysiloxane-based adhesive composition.

Abstract: A composition for coating glass fiber articles such as glass sleeve, glass cloth, glass roving, glass tape, glass mat or glass nonwoven fiber, comprising(a) a diorganopolysiloxane end-blocked with a divinylmonoorganosilyl or trivinylsilyl radical at both ends,(b) a sufficient amount of an organohydrogenpolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule to provide at least 0.5 silicon-bonded hydrogen atoms per vinyl radical in component (a), and(c) a catalytic amount of platinum or a platinum compound.

Abstract: Novel silicon-containing derivatives of polybutadiene or copolymers of butadiene with other copolymerizable monomer or monomers in which organosilicon-containing groups are bonded to the carbon atoms in the main chain of the butadiene polymers through the carbon-silicon linkages. These derivatives of butadiene polymers are produced by the addition reaction of an organosilicon compound having one hydrogen atom directly bonded to the silicon atom in the molecule to the double bonds in the butadiene polymers. They have a good fluidity, a small temperature dependency of viscosity, an excellent thermal stability and a high anti-oxidation resistance, as well as a good compatibility with siliceous fillers which are added to give improved workability and transparency to the compositions. The compositions to which a crosslinking agent and a curing catalyst are added can be cured into a rubber-like elastomer having excellent properties suitable for applications in various fields.

Abstract: The curable composition provided by the present invention comprises a butadiene polymer having organosilicon groups as the pendant groups, an ethylenically unsaturated polymerizable compound, an organic peroxide, and optionally a filler. The butadiene polymer being the base of this composition can readily be obtained by the platinum-catalyzed addition reaction between an organosilicon compound having a hydrogen atom directly bonded to the silicon atom in a molecule and the ethylenic unsaturation of a conventional butadiene polymer.The compositions of the invention are remarkably superior in many respects to those composition based on ordinary butadiene polymers, and useful for applications in a wide variety including the production of electrically insulating materials and various kinds of industrial articles.