Patents by Inventor Kin Cheung

Kin Cheung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240207301
    Abstract: An object of the present invention is to provide a pharmaceutical composition and an anti-tumor agent that exhibit an effect on a tumor having a decreased function of at least one of BAP1 or PBRM1. According to the present invention, there is provided a pharmaceutical composition for the treatment of a tumor having a decreased function of at least one of BAP1 or PBRM1, the pharmaceutical composition including 1-(2-deoxy-2-fluoro-4-thio-?-D-arabinofuranosyl)cytosine or a salt or prodrug thereof.
    Type: Application
    Filed: January 26, 2024
    Publication date: June 27, 2024
    Applicant: FUJIFILM Corporation
    Inventors: Kazunori SAEKI, David WAGES, Kin CHEUNG, Filip JANKU
  • Patent number: 11294075
    Abstract: A non-resonant ESR instrument/probe that can easily accept an identification card (or the like) form factor device incorporating a radiation sensitive material providing reliable and calibrated dose measurement stably and permanently stored into the device and deployed to individual, persons, animals, or objects, to act as a personal-surrogate dosimeter primarily in radiation mass events with radiation dose derived from a measure of the radiation induced changes in paramagnetic density obtained via transmission mode electron spin resonance measurements.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: April 5, 2022
    Assignee: Government of the United States of America as represented by the Secretary of Commerce
    Inventors: Jason Campbell, Jason Ryan, Kin Cheung, Marc Desrosiers, Robert Gougelet, Pragya Shrestha
  • Patent number: 10834571
    Abstract: A system and method for implementing Steering of Roaming for 5G core roaming in an Internet Packet Exchange (IPX) network. A Hypertext Transfer Protocol (HTTP)/2 Proxy is deployed in an IPX network. The HTTP/2 Proxy receives N32-f request message from a Visited Public Land Mobile Network (VPLMN). The N32-f request has an embedded N12 authorization request message or an embedded N8 registration request message. If VPLMN is a non-preferred roaming partner, the HTTP/2 Proxy appends a patch-request to N32-f request message and routes it to the Home Public Land Mobile Network (HPLMN). The patch-request causes the home Security Edge Protection Proxy (hSEPP) to replace Mobile Country Code (MCC) or Mobile Network Code (MNC) value with a predefined value that will trigger a rejection from HPLMN. The mobile device will select another VPLMN. If the VPLMN is a preferred roaming partner, the HTTP/2 Proxy routes the request without appending a patch-request.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: November 10, 2020
    Assignee: Syniverse Technologies, LLC
    Inventors: Edward Yau, Kin Cheung, Jerry Handra, Chi Lap Seto, Jacky Luk, Kenneth Mak
  • Publication number: 20200003909
    Abstract: A non-resonant ESR instrument/probe that can easily accept an identification card (or the like) form factor device incorporating a radiation sensitive material providing reliable and calibrated dose measurement stably and permanently stored into the device and deployed to individual, persons, animals, or objects, to act as a personal-surrogate dosimeter primarily in radiation mass events with radiation dose derived from a measure of the radiation induced changes in paramagnetic density obtained via transmission mode electron spin resonance measurements.
    Type: Application
    Filed: March 2, 2018
    Publication date: January 2, 2020
    Applicant: Global Resonance Technologies, LLC
    Inventors: Jason Campbell, Jason Ryan, Kin Cheung, Marc Desrosiers, Robert Gougelet, Pragya Shrestha
  • Patent number: 10432583
    Abstract: This invention is a system and method for a high-performance Diameter Routing Agent (DRA) platform with a three-tier architecture. The DRA platform consists of a Diameter Connection Router (DCR), a Diameter Load Balancer (DLB), and multiple DRA Instances. DCR is a front-end to all external Peers and distributes Diameter connections to a DLB. DLB is a Diameter transaction load balancer and distributes individual Diameter transaction to a DRA. DRA is a Diameter Routing Agent to implement business logic to determine routing of an incoming request to a destination peer as well as message mediation. A public Internet Protocol (IP) address of the DCR is exposed to the external peers as a single point of contact between the peers and the computer network, wherein an internal topology of the computer network remains hidden from the peers.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: October 1, 2019
    Assignee: Syniverse Technologies, LLC
    Inventors: Edward Yau, Paul Sun, Jerry Handra, Kin Cheung, Jacky Luk, Kenneth Mak
  • Publication number: 20190288983
    Abstract: This invention is a system and method for a high-performance Diameter Routing Agent (DRA) platform with a three-tier architecture. The DRA platform consists of a Diameter Connection Router (DCR), a Diameter Load Balancer (DLB), and multiple DRA Instances. DCR is a front-end to all external Peers and distributes Diameter connections to a DLB. DLB is a Diameter transaction load balancer and distributes individual Diameter transaction to a DRA. DRA is a Diameter Routing Agent to implement business logic to determine routing of an incoming request to a destination peer as well as message mediation. A public Internet Protocol (IP) address of the DCR is exposed to the external peers as a single point of contact between the peers and the computer network, wherein an internal topology of the computer network remains hidden from the peers.
    Type: Application
    Filed: March 14, 2019
    Publication date: September 19, 2019
    Inventors: Edward Yau, Paul Sun, Jerry Handra, Kin Cheung, Jacky Luk, Kenneth Mak
  • Patent number: 10397176
    Abstract: This invention is a system and method for an interworking function that handles communications between Rich Communication Services (RCS) Pre-Universal Profile (Pre-UP) and Universal Profile (UP) clients, and their Controlling Function and Participating Function service points. The interworking function supports the interworking for Pre-UP and UP clients in the following scenarios: 1) CPM Standalone Messaging and CPM 1-to-1 Chat, 2) CPM Chat and IM/SIMPLE Chat, 3) File Transfer by MSRP and File Transfer by HTTP, and 4) Open Group Chat and Closed Group Chat. The interworking function performs the necessary SIP message conversation and/or headers and message bodies manipulation, acts as MSRP client and server, acts as a HTTP server to store file for file transfer interworking, and acts as message proxy for Controlling Function and Participating Function.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: August 27, 2019
    Assignee: Syniverse Technologies, LLC
    Inventors: Edward Yau, Faron Achziger, Prashant Datar, Kin Cheung, Frank Chun, Patrick Correia
  • Publication number: 20190222550
    Abstract: This invention is a system and method for an interworking function that handles communications between Rich Communication Services (RCS) Pre-Universal Profile (Pre-UP) and Universal Profile (UP) clients, and their Controlling Function and Participating Function service points. The interworking function supports the interworking for Pre-UP and UP clients in the following scenarios: 1) CPM Standalone Messaging and CPM 1-to-1 Chat, 2) CPM Chat and IM/SIMPLE Chat, 3) File Transfer by MSRP and File Transfer by HTTP, and 4) Open Group Chat and Closed Group Chat. The interworking function performs the necessary SIP message conversation and/or headers and message bodies manipulation, acts as MSRP client and server, acts as a HTTP server to store file for file transfer interworking, and acts as message proxy for Controlling Function and Participating Function.
    Type: Application
    Filed: January 10, 2019
    Publication date: July 18, 2019
    Inventors: Edward Yau, Faron Achziger, Prashant Datar, Kin Cheung, Frank Chun, Patrick Correia
  • Publication number: 20050250253
    Abstract: A process for packaging and sealing a microscopic structure device is provided. The process for the present invention includes the steps of depositing a capping layer of sacrificial material patterned by lithography over the microscopic structure supported on a substrate, depositing a support layer of a dielectric material patterned by lithography over the capping layer, providing a plurality of vias through the support layer by lithography, removing the capping layer via wet etching to leave the support layer intact in the form of a shell having a cavity occupied by the microscopic structure, depositing a layer of meltable material over the capping layer that is thick enough to provide a barrier against gas permeation, but thin enough to leave the vias open, and selectively applying a laser beam to the meltable material proximate each via for a sufficient period of time to melt the material for sealing the via.
    Type: Application
    Filed: June 14, 2005
    Publication date: November 10, 2005
    Inventor: Kin Cheung
  • Publication number: 20050189621
    Abstract: A process for hermetically packaging a microscopic structure including a MEMS device is provided. The process for the present invention includes the steps of depositing a capping layer of sacrificial material patterned by lithography over the microscopic structure supported on a substrate, depositing a support layer of a dielectric material patterned by lithography over the capping layer, providing a plurality of vias through the support layer by lithography, removing the capping layer via wet etching to leave the support layer intact in the form of a shell having a cavity occupied by the microscopic structure, depositing a metal layer over the capping layer that is thick enough to provide a barrier against gas permeation, but thin enough to leave the vias open, and selectively applying under high vacuum a laser beam to the metal proximate each via for a sufficient period of time to melt the metal for sealing the via.
    Type: Application
    Filed: May 3, 2005
    Publication date: September 1, 2005
    Inventor: Kin Cheung
  • Patent number: D415677
    Type: Grant
    Filed: October 30, 1997
    Date of Patent: October 26, 1999
    Assignee: Sing Sing Fibers Industry Co., Ltd.
    Inventor: Kin Cheung