Patents by Inventor Kin Cheung Lo

Kin Cheung Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11242609
    Abstract: Silver-nickel alloy electroplating compositions and methods enable electroplating silver rich silver-nickel deposits which are bright, uniform and have a relatively low coefficient of friction. The binary silver-nickel alloy is deposited from an aqueous acid silver-nickel alloy electroplating composition. The aqueous acid silver-nickel alloy electroplating composition includes thiol compounds which shift the reduction potential of silver ions toward the reduction potential of nickel ions such that a silver rich binary silver-nickel layer is deposited on a substrate.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: February 8, 2022
    Assignee: ROHM AND HASS ELECTRONIC MATERIALS LLC
    Inventors: Jamie Y. C. Chen, Michael Lipschutz, Miguel A. Rodriguez, Kin Cheung Lo
  • Publication number: 20210108324
    Abstract: Silver-nickel alloy electroplating compositions and methods enable electroplating silver rich silver-nickel deposits which are bright, uniform and have a relatively low coefficient of friction. The binary silver-nickel alloy is deposited from an aqueous acid silver-nickel alloy electroplating composition. The aqueous acid silver-nickel alloy electroplating composition includes thiol compounds which shift the reduction potential of silver ions toward the reduction potential of nickel ions such that a silver rich binary silver-nickel layer is deposited on a substrate.
    Type: Application
    Filed: October 15, 2019
    Publication date: April 15, 2021
    Inventors: Jamie Y.C. Chen, Michael Lipschutz, Miguel A. Rodriguez, Kin Cheung Lo