Patents by Inventor Kin-Chung R. Chiu

Kin-Chung R. Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4735633
    Abstract: Vapor phase waste species are removed from effluent gas streams using a plasma extraction reactor comprising a pair of parallel, spaced-apart electrodes. The electrodes are driven under conditions, usually at radio frequency, to induce a glow discharge in the waste species, and the excited species are deposited directly on the electrode surface. By providing a very high ratio of electrode area to reactor volume and waste gas volumetric flow rate, substantially complete removal of the waste species can be effected. The system is particularly useful in removing contaminant species discharged from semiconductor processing operations, such as chemical vapor deposition and plasma etching. The method and system are particularly advantageous in that the vapor phase waste products are converted to a solid phase deposited directly on the electrodes which may then be disposed of.
    Type: Grant
    Filed: June 23, 1987
    Date of Patent: April 5, 1988
    Inventor: Kin-Chung R. Chiu
  • Patent number: 4554045
    Abstract: Described is a method for producing semiconductor heterostructures incorporating a metal layer. The metal layer, typically a metal-silicide, can be produced by, e.g., co-deposition or reaction with the substrate. The resulting silicide is typically epitaxial and of high crystalline perfection.
    Type: Grant
    Filed: November 29, 1982
    Date of Patent: November 19, 1985
    Assignee: AT&T Bell Laboratories
    Inventors: John C. Bean, Kin-Chung R. Chiu, John M. Poate
  • Patent number: 4492971
    Abstract: Described are semiconductor heterostructures incorporating a metal layer. Devices based on the heterostructures are described, as are techniques for preparing the heterostructures. Specific embodiments wherein the metal layer is a metal silicide are detailed, and hot electron devices using this structure are analyzed briefly.
    Type: Grant
    Filed: June 5, 1980
    Date of Patent: January 8, 1985
    Assignee: AT&T Bell Laboratories
    Inventors: John C. Bean, Kin-Chung R. Chiu, John M. Poate