Patents by Inventor Kin Fung YU

Kin Fung YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Atomization mechanism for cooling a bond head
    Patent number: 10312214
    Abstract: An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: June 4, 2019
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Yi Kei Law, Chuek Wah Tang, Pak Kin Leung, Gary Peter Widdowson, Wing Chiu Lai, Kin Fung Yu, Jiang Wen Deng
  • Pick arm comprising a winged part for a bonding apparatus
    Patent number: 10192761
    Abstract: A pick arm for a pick and place apparatus for semiconductor devices, the pick arm comprising first and second ends along a longitudinal axis of the pick arm, and a pick tool located at the first end of the pick arm for picking up semiconductor devices. The pick arm further comprises a winged part extending in a direction transverse to the longitudinal axis between the first and second ends of the pick arm, wherein the winged part comprising a sloping surface. The sloping surface is inclined between a top portion and a bottom portion of the winged part such that the sloping surface is nearer to the longitudinal axis at the top portion than at the bottom portion of the winged part.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: January 29, 2019
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Kin Fung Yu, Yu Xing Cao, Wing Chiu Lai, Kai Siu Lam, Gary Peter Widdowson, Ying Zhuo Liu
  • ATOMIZATION MECHANISM FOR COOLING A BOND HEAD
    Publication number: 20180068973
    Abstract: An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.
    Type: Application
    Filed: September 8, 2016
    Publication date: March 8, 2018
    Inventors: Yi Kei LAW, Chuek Wah TANG, Pak Kin LEUNG, Gary Peter WIDDOWSON, Wing Chiu LAI, Kin Fung YU, Jiang Wen DENG
  • PICK ARM COMPRISING A WINGED PART FOR A BONDING APPARATUS
    Publication number: 20170238449
    Abstract: A pick arm for a pick and place apparatus for semiconductor devices, the pick arm comprising first and second ends along a longitudinal axis of the pick arm, and a pick tool located at the first end of the pick arm for picking up semiconductor devices. The pick arm further comprises a winged part extending in a direction transverse to the longitudinal axis between the first and second ends of the pick arm, wherein the winged part comprising a sloping surface. The sloping surface is inclined between a top portion and a bottom portion of the winged part such that the sloping surface is nearer to the longitudinal axis at the top portion than at the bottom portion of the winged part.
    Type: Application
    Filed: February 9, 2017
    Publication date: August 17, 2017
    Inventors: Kin Fung YU, Yu Xing CAO, Wing Chiu LAI, Kai Siu LAM, Gary Peter WIDDOWSON, Ying Zhuo LIU