Patents by Inventor Kin Lau

Kin Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240126916
    Abstract: Methods, media, and systems are provided for centralized and decentralized protection of sensitive data. Sensitive data, for example, may include personal user data or data protected by data privacy regulations. A router may receive data from a user device. In an embodiment, the data may be received from an application that is managed by a Kubernetes cluster. In some embodiments, the application provides an active user interface that includes one or more sensitive fields for entering sensitive data. A machine learning model may be used to detect that the data being received by the router includes sensitive data. Additionally, the machine learning model may detect an entry of sensitive data at one or more sensitive fields on one or more active user interfaces. The machine learning model may be trained using a plurality of application programming interface requests. A masking technique may be applied to the sensitive data.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 18, 2024
    Inventors: Phi Hoang Nguyen, Kevin Ka-Kin Lau
  • Publication number: 20240040746
    Abstract: An adapter for coupling a liquid cooling loop subassembly of a computing system to a device rack manifold includes a main body, a first connector disposed on the main body, a second connector disposed on the main body, and a flow control device disposed between the first and second connectors. The first connector couples the adapter to a coupling of the liquid cooling loop subassembly. The second connector couples the adapter to the device rack manifold. The flow control device may be configured to regulate a flow rate of liquid coolant through the liquid cooling loop subassembly. The adapter may be further incorporated into a rack assembly or multi-rack assembly to achieve thermal management of multiple computing systems with cooling loop subassemblies.
    Type: Application
    Filed: August 1, 2022
    Publication date: February 1, 2024
    Inventors: Feini Zhang, Xu Zuo, Michael Chi Kin Lau, Madhusudan K. Iyengar
  • Publication number: 20230379224
    Abstract: A system, methods, and computer-readable media are provided herein for real-time “live” identification of connectivity issues with autonomous predictive solution provision via a diagnostic application supported by a machine-learning model. In aspects, live data in a targeted application is captured in an on-going manner and used by the diagnostic application to automatically identify connectivity issues. When connectivity issues are detected, the live data capture is pushed to the model so that the model can make a predictive classification of the error based on geospatial, temporal, and/or geospatial-temporal alignments in the data. Based on the classification, the model predicts a solution and the diagnostic application provides the solution to the user of the targeted application.
    Type: Application
    Filed: August 4, 2023
    Publication date: November 23, 2023
    Applicant: T-MOBILE INNOVATIONS LLC
    Inventors: Phi Hoang NGUYEN, Kevin Ka-Kin LAU
  • Publication number: 20230327958
    Abstract: A system, methods, and computer-readable media are provided herein for real-time “live” identification of connectivity issues with autonomous predictive solution provision via a diagnostic application supported by a machine-learning model. In aspects, live data in a targeted application is captured in an on-going manner and used by the diagnostic application to automatically identify connectivity issues. When connectivity issues are detected, the live data capture is pushed to the model so that the model can make a predictive classification of the error based on geospatial, temporal, and/or geospatial-temporal alignments in the data. Based on the classification, the model predicts a solution and the diagnostic application provides the solution to the user of the targeted application.
    Type: Application
    Filed: April 6, 2022
    Publication date: October 12, 2023
    Inventors: Phi Hoang NGUYEN, Kevin Ka-Kin LAU
  • Patent number: 11765045
    Abstract: A system, methods, and computer-readable media are provided herein for real-time “live” identification of connectivity issues with autonomous predictive solution provision via a diagnostic application supported by a machine-learning model. In aspects, live data in a targeted application is captured in an on-going manner and used by the diagnostic application to automatically identify connectivity issues. When connectivity issues are detected, the live data capture is pushed to the model so that the model can make a predictive classification of the error based on geospatial, temporal, and/or geospatial-temporal alignments in the data. Based on the classification, the model predicts a solution and the diagnostic application provides the solution to the user of the targeted application.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: September 19, 2023
    Assignee: T-Mobile Innovations LLC
    Inventors: Phi Hoang Nguyen, Kevin Ka-Kin Lau
  • Publication number: 20230244046
    Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.
    Type: Application
    Filed: April 6, 2023
    Publication date: August 3, 2023
    Inventors: William F. Edwards, JR., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
  • Patent number: 11650384
    Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.
    Type: Grant
    Filed: February 9, 2022
    Date of Patent: May 16, 2023
    Assignee: Google LLC
    Inventors: William F. Edwards, Jr., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
  • Patent number: 11477908
    Abstract: A data center rack system includes a rack housing that includes side panels and a top panel coupled to the side panels, the top and side panels defining a rack volume sized to enclose a plurality of data center server rack trays, each of the data center server rack trays configured to support a plurality of heat generating electronic devices; and a rack bottom coupled to the side panels to at least partially define the rack volume, the rack bottom including a bottom panel having a top surface coupled to the side panels and a plurality of blocks coupled to a bottom surface of the bottom panel opposite the top surface, at least one pair of the plurality of blocks defining an opening between the blocks and below the bottom surface of the bottom panel and sized to receive a lifting member of a lifting machine.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: October 18, 2022
    Assignee: Google LLC
    Inventors: Jayson Michael Jochim, Michael Chi Kin Lau, Winnie Leung
  • Publication number: 20220269019
    Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 25, 2022
    Inventors: William F. Edwards, JR., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
  • Patent number: 11395432
    Abstract: Techniques for managing data center electronic devices in a data center include operating data center server devices that define a particular amount of computing power of a data center, the devices supported in server racks positioned in a frame assembly that includes bays defined along a lengthwise dimension of the frame assembly, the bays arranged in stacked layers that include at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays, the server racks positioned in at least one of the bays of the first or second layers of bays; determining that at least one of the server devices requires a maintenance operation; based on the determination, operating an automated service machine to move to a location in the data center that is adjacent to the data center server device; and performing the maintenance operation on the at least one data center server device with the automated service machine.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: July 19, 2022
    Assignee: Google LLC
    Inventors: Jayson Michael Jochim, Michael Chi Kin Lau, Bill Dailey, Angela Chen, Winnie Leung
  • Patent number: 11357135
    Abstract: A data center system includes a frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, the plurality of bays arranged in a plurality of stacked layers of bays, the plurality of stacked layers including at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays; a plurality of server racks positioned in the bays of the first layer of bays, each of the server racks configured to support a plurality of data center server devices that define a particular amount of computing power; and a plurality of network switches positioned in the bays of the second layer of bays, each of the network switches communicably coupled to at least one of the data center server devices in the first layer of bays.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: June 7, 2022
    Assignee: Google LLC
    Inventors: Jayson Michael Jochim, Michael Chi Kin Lau, Bill Dailey, Angela Chen, Winnie Leung, Peter Pellerzi, Soheil Farshchian
  • Patent number: 11297736
    Abstract: A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: April 5, 2022
    Assignee: Google LLC
    Inventors: Jayson Michael Jochim, Angela Chen, Soheil Farshchian, Winnie Leung, Michael Chi Kin Lau
  • Patent number: 11249264
    Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: February 15, 2022
    Assignee: Google LLC
    Inventors: William F. Edwards, Jr., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
  • Publication number: 20220003946
    Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.
    Type: Application
    Filed: December 15, 2020
    Publication date: January 6, 2022
    Inventors: William F. Edwards, Jr., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
  • Patent number: 11044834
    Abstract: An apparatus includes a housing having a bottom surface and one or more mounting members that enable the housing to be mounted in a rack. The apparatus includes liquid cooling components mounted within the housing. The liquid cooling components include tubing within which a coolant may be communicated, and a heat exchange component that thermally couples a heat load within the housing to the coolant so that heat from the heat load is transferred to the coolant. The bottom surface of the housing defines a drain path. The heat exchange component is positioned in a downward direction of gravity relative to the heat load when the housing is mounted in the rack. In the event of a coolant leak, the coolant leak will occur beneath the heat load and the coolant will flow away from the heat load and exit the housing by use of the drain path.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: June 22, 2021
    Assignee: Google LLC
    Inventors: Michael Chi Kin Lau, William F. Edwards, Jr., Justin S. Lee, Winnie Leung
  • Publication number: 20210112676
    Abstract: Techniques for managing data center electronic devices in a data center include operating data center server devices that define a particular amount of computing power of a data center, the devices supported in server racks positioned in a frame assembly that includes bays defined along a lengthwise dimension of the frame assembly, the bays arranged in stacked layers that include at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays, the server racks positioned in at least one of the bays of the first or second layers of bays; determining that at least one of the server devices requires a maintenance operation; based on the determination, operating an automated service machine to move to a location in the data center that is adjacent to the data center server device; and performing the maintenance operation on the at least one data center server device with the automated service machine.
    Type: Application
    Filed: December 8, 2020
    Publication date: April 15, 2021
    Inventors: Jayson Michael Jochim, Michael Chi Kin Lau, Bill Dailey, Angela Chen, Winnie Leung
  • Publication number: 20210100136
    Abstract: A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.
    Type: Application
    Filed: December 10, 2020
    Publication date: April 1, 2021
    Inventors: Jayson Michael Jochim, Angela Chen, Soheil Farshchian, Winnie Leung, Michael Chi Kin Lau
  • Publication number: 20210007249
    Abstract: A data center system includes a frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, the plurality of bays arranged in a plurality of stacked layers of bays, the plurality of stacked layers including at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays; a plurality of server racks positioned in the bays of the first layer of bays, each of the server racks configured to support a plurality of data center server devices that define a particular amount of computing power; and a plurality of network switches positioned in the bays of the second layer of bays, each of the network switches communicably coupled to at least one of the data center server devices in the first layer of bays.
    Type: Application
    Filed: September 21, 2020
    Publication date: January 7, 2021
    Inventors: Jayson Michael Jochim, Michael Chi Kin Lau, Bill Dailey, Angela Chen, Winnie Leung, Peter Pellerzi, Soheil Farshchian
  • Patent number: 10888029
    Abstract: A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: January 5, 2021
    Assignee: Google LLC
    Inventors: Jayson Michael Jochim, Angela Chen, Soheil Farshchian, Winnie Leung, Michael Chi Kin Lau
  • Patent number: 10888013
    Abstract: Techniques for managing data center electronic devices in a data center include operating data center server devices that define a particular amount of computing power of a data center, the devices supported in server racks positioned in a frame assembly that includes bays defined along a lengthwise dimension of the frame assembly, the bays arranged in stacked layers that include at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays, the server racks positioned in at least one of the bays of the first or second layers of bays; determining that at least one of the server devices requires a maintenance operation; based on the determination, operating an automated service machine to move to a location in the data center that is adjacent to the data center server device; and performing the maintenance operation on the at least one data center server device with the automated service machine.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: January 5, 2021
    Assignee: Google LLC
    Inventors: Jayson Michael Jochim, Michael Chi Kin Lau, Bill Dailey, Angela Chen, Winnie Leung