Patents by Inventor Kin Sun Wong

Kin Sun Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9140748
    Abstract: Systems, methods, and apparatuses are provided for facilitating the use of a burn in board comprising integrated circuits. An apparatus may comprise a burn in board and a plurality of integrated circuits connected to the burn in board. Each integrated circuit may be configured to at least connect to a plurality of components to be subjected to a burn in process at room temperature; receive at least one signal for testing the plurality of components during the burn in process; and transmit the at least one signal to each of the plurality of components. Corresponding systems and methods are also provided.
    Type: Grant
    Filed: May 14, 2012
    Date of Patent: September 22, 2015
    Assignee: Macronix International Co., Ltd.
    Inventors: Kin Sun Wong, Che Chin Wu
  • Publication number: 20130300444
    Abstract: Systems, methods, and apparatuses are provided for facilitating the use of a burn in board comprising integrated circuits. An apparatus may comprise a burn in board and a plurality of integrated circuits connected to the burn in board. Each integrated circuit may be configured to at least connect to a plurality of components to be subjected to a burn in process at room temperature; receive at least one signal for testing the plurality of components during the burn in process; and transmit the at least one signal to each of the plurality of components. Corresponding systems and methods are also provided.
    Type: Application
    Filed: May 14, 2012
    Publication date: November 14, 2013
    Applicant: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Kin Sun Wong, Che Chin Wu
  • Patent number: 7820093
    Abstract: A method for processing a stamp material generally includes: heating one of a pressing member and a surface layer of the stamp material; pressing the surface layer of the stamp material using the pressing member; and cooling the stamp material to normal temperature.
    Type: Grant
    Filed: January 10, 2008
    Date of Patent: October 26, 2010
    Inventors: Kin Sun Wong, Kam Hung Wan, Hin Wah Wallace Tsang, Kam Kwong Raymond Wan
  • Publication number: 20090179348
    Abstract: A method for processing a stamp material generally includes: heating one of a pressing member and a surface layer of the stamp material; pressing the surface layer of the stamp material using the pressing member; and cooling the stamp material to normal temperature.
    Type: Application
    Filed: January 10, 2008
    Publication date: July 16, 2009
    Inventors: Kin Sun WONG, Kam Hung Wan, Hin Wah Wallace Tsang, Kam Kwong Raymond Wan
  • Publication number: 20080014381
    Abstract: A seal material has double-layer structure and makes use of the respective virtue of each layer. The seal material includes a lettering layer and an ink seeping layer which superposes and bonds together. The method of making the seal material includes the process of heating both layers' material to squeeze and mold. The seal made with the material of the present invention provides the virtues of higher clarity of impressing, higher speed of ink injection, and without the shortcoming of ink scarcity.
    Type: Application
    Filed: February 2, 2007
    Publication date: January 17, 2008
    Inventors: Kin Sun Wong, Kam Hung Wan, Hin Wah Wallace Tsang, Kam Kwong Raymond Wan
  • Patent number: 5438929
    Abstract: A printing stamp comprises a housing 9, a stamp mounting member 12 slidably mounted within the housing for movement between an inoperative position and a printing position, an operating member 11 for moving the stamp mounting member from its inoperative position to its printing position against the urging force of a spring 19 and a handle 10 connected to the operating member. The handle is releasably connected to the operating member such as by a slidable friction fit in order that the handle can be removed to allow the stamp to be more easily transported to points-of-need.
    Type: Grant
    Filed: March 15, 1994
    Date of Patent: August 8, 1995
    Assignees: Kin-Sung Wong, Kam-Hung Wan
    Inventors: Kin-Sun Wong, Kam-Hung Wan