Patents by Inventor Kin Yik Hung
Kin Yik Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240339430Abstract: A bonding system for bonding an electronic component to a base member includes a first container for forming a first inert environment where the base member is locatable during bonding of the electronic component. A first plasma cleaning device is located in the first container to clean the electronic component and/or the base member by removing metal oxides therefrom. A second plasma cleaning device is also provided to clean the electronic component by removing organic contaminants therefrom before the electronic component is conveyed into the first container. A bond head is movably installed in the first container to bond the electronic component to the base member after the electronic component and/or the base member have been cleaned by the first plasma cleaning device.Type: ApplicationFiled: April 10, 2023Publication date: October 10, 2024Inventors: Zetao MA, Ming LI, Chun Ho FAN, Kin Yik HUNG, Siu Wing LAU
-
Patent number: 10475763Abstract: A die bonding apparatus comprising a first inert gas container having a first inert gas concentration, and a second inert gas container having a second inert gas concentration enclosed within the first inert gas container. The second inert gas concentration is higher than the first inert gas concentration. The die bonding apparatus further comprises a bond head located in the second inert gas container for receiving a die for bonding, and a third inert gas container having an inert gas environment that is separate from the first and second inert gas containers and where a substrate is locatable for die bonding. The bond head is operative to move the die between a first position within the second inert container and a second position within the third inert gas container to bond the die onto the substrate located in the third inert gas container.Type: GrantFiled: May 20, 2016Date of Patent: November 12, 2019Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Siu Wing Lau, Kin Yik Hung, Yuk Cheung Au, Wing Chiu Lai, Leo Man Lee, Sai Yuen Go
-
Publication number: 20160351527Abstract: A die bonding apparatus comprising a first inert gas container having a first inert gas concentration, and a second inert gas container having a second inert gas concentration enclosed within the first inert gas container. The second inert gas concentration is higher than the first inert gas concentration. The die bonding apparatus further comprises a bond head located in the second inert gas container for receiving a die for bonding, and a third inert gas container having an inert gas environment that is separate from the first and second inert gas containers and where a substrate is locatable for die bonding. The bond head is operative to move the die between a first position within the second inert container and a second position within the third inert gas container to bond the die onto the substrate located in the third inert gas container.Type: ApplicationFiled: May 20, 2016Publication date: December 1, 2016Inventors: Siu Wing LAU, Kin Yik HUNG, Yuk Cheung AU, Wing Chiu LAI, Leo Man LEE, Sai Yuen GO
-
Patent number: 9281290Abstract: A bond head for thermal compression die bonding comprises a collet operative to support a die on a first side of the collet during die bonding and a bond head heater located on a second side of the collet opposite to the first side for heating the collet and the die. A die vacuum suction hole on the bond head heater applies a vacuum suction force to hold the collet, and a collet vacuum suction hole on the bond head heater applies a vacuum suction force to hold the die. At least one vacuum distribution channel that is formed on the second side of the collet is in fluid communication with the collet vacuum suction hole and distributes the vacuum suction force across a surface of the second side of the collet for securing the collet.Type: GrantFiled: July 30, 2012Date of Patent: March 8, 2016Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Kin Yik Hung, Pak Kin Leung, Cheuk Wah Tang, Chi Ping Hung, Gary Peter Widdowson
-
Patent number: 8857486Abstract: An electronic device bonding apparatus comprises a flip arm for picking up an electronic device, the flip arm being operative to invert an orientation of the electronic device. A collet tool which contacts the electronic device and secures it to the flip arm is detachably mountable onto the flip arm, and a bond arm may pick up the electronic device from the collet tool to bond the electronic device to a bonding surface. Additionally, a tool changer module is operative to detach the collet tool from the flip arm and to mount another collet tool onto the flip arm.Type: GrantFiled: May 4, 2011Date of Patent: October 14, 2014Assignee: ASM Technology Singapore Pte. Ltd.Inventors: Chi Fung Chan, Kin Yik Hung
-
Publication number: 20140027068Abstract: A bond head for thermal compression die bonding comprises a collet operative to support a die on a first side of the collet during die bonding and a bond head heater located on a second side of the collet opposite to the first side for heating the collet and the die. A die vacuum suction hole on the bond head heater applies a vacuum suction force to hold the collet, and a collet vacuum suction hole on the bond head heater applies a vacuum suction force to hold the die. At least one vacuum distribution channel that is formed on the second side of the collet is in fluid communication with the collet vacuum suction hole and distributes the vacuum suction force across a surface of the second side of the collet for securing the collet.Type: ApplicationFiled: July 30, 2012Publication date: January 30, 2014Inventors: Kin Yik HUNG, Pak Kin LEUNG, Cheuk Wah TANG, Chi Ping HUNG, Gary Peter WIDDOWSON
-
Publication number: 20120279660Abstract: An electronic device bonding apparatus comprises a flip arm for picking up an electronic device, the flip arm being operative to invert an orientation of the electronic device. A collet tool which contacts the electronic device and secures it to the flip arm is detachably mountable onto the flip arm, and a bond arm may pick up the electronic device from the collet tool to bond the electronic device to a bonding surface. Additionally, a tool changer module is operative to detach the collet tool from the flip arm and to mount another collet tool onto the flip arm.Type: ApplicationFiled: May 4, 2011Publication date: November 8, 2012Applicant: ASM TECHNOLOGY SINGAPORE PTE LTD.Inventors: Chi Fung CHAN, Kin Yik HUNG
-
Patent number: 7667355Abstract: A linear motor comprising a coil assembly and a magnet assembly is provided with a cooling apparatus which comprises a segmented air knife assembly. The segmented air knife assembly has a plurality of slot openings distributed along its length which is coupled to the linear motor and it is operative to discharge cooling air into a gap between the coil assembly and magnet assembly in a discharge direction. An inclined surface extends from the plurality of slot openings and slopes at an obtuse angle away from the discharge direction of the cooling air. Each slot opening is individually configured to discharge the cooling air in the discharge direction at a sufficient velocity so as to entrain atmospheric air along the inclined surface to amplify the cooling air that is so discharged.Type: GrantFiled: January 4, 2008Date of Patent: February 23, 2010Assignee: ASM Assembly Automation Ltd.Inventors: Yuk Cheung Au, Kin Yik Hung, Wing Chiu Derek Lai, Pak Kin Leung, Cheuk Wah Chester Tang, Wai Lam
-
Publication number: 20090195088Abstract: A linear motor comprising a coil assembly and a magnet assembly is provided with a cooling apparatus which comprises a segmented air knife assembly. The segmented air knife assembly has a plurality of slot openings distributed along its length which is coupled to the linear motor and it is operative to discharge cooling air into a gap between the coil assembly and magnet assembly in a discharge direction. An inclined surface extends from the plurality of slot openings and slopes at an obtuse angle away from the discharge direction of the cooling air. Each slot opening is individually configured to discharge the cooling air in the discharge direction at a sufficient velocity so as to entrain atmospheric air along the inclined surface to amplify the cooling air that is so discharged.Type: ApplicationFiled: January 4, 2008Publication date: August 6, 2009Inventors: Yuk Cheung AU, Kin Yik HUNG, Wing Chiu Derek LAI, Pak Kin LEUNG, Cheuk Wah Chester TANG, Wai LAM
-
Patent number: 7402778Abstract: An oven is provided for curing or reflowing compounds on objects, such as lead frames or other substrates. The oven comprises a heating chamber, a heating assembly mounted in thermal communication with the heating chamber to provide heat thereto, and a support assembly for supporting the object in the heating chamber for heating. The heating assembly and support assembly are configured to be movable relative to one another for controllably positioning the object at variable distances with respect to the heating assembly. Heating of the object according to a heating profile can thus be achieved by controlled heating of the object at different temperatures by positioning the object at different distances with respect to the heating assembly during the heating process although there is a single heating zone.Type: GrantFiled: April 29, 2005Date of Patent: July 22, 2008Assignee: ASM Assembly Automation Ltd.Inventors: Kin Yik Hung, Srikanth Narasimalu, Wei Ling Chan, Man Wai Chan, Cheuk Wah Tang, Kai Chiu Wu
-
Patent number: 7002283Abstract: The invention provides an ultrasonic transducer assembly for a bonding apparatus, comprising a bonding tool mounted to an amplifying horn secured between first and second ultrasonic-generating means. A method of forming a transducer for a bonding apparatus is also provided, comprising the steps of providing an amplifying horn, securing first and second ultrasonic-generating means to the amplifying horn such that the amplifying horn is located between said first and second ultrasonic-generating means and mounting a bonding tool to the amplifying horn.Type: GrantFiled: June 3, 2003Date of Patent: February 21, 2006Assignee: ASM Assembly Automation Ltd.Inventors: Hing Leung Marchy Li, Kin Yik Hung, Ming Wai Kelvin Ng
-
Publication number: 20040245893Abstract: The invention provides an ultrasonic transducer assembly for a bonding apparatus, comprising a bonding tool mounted to an amplifying horn secured between first and second ultrasonic-generating means. A method of forming a transducer for a bonding apparatus is also provided, comprising the steps of providing an amplifying horn, securing first and second ultrasonic-generating means to the amplifying horn such that the amplifying horn is located between said first and second ultrasonic-generating means and mounting a bonding tool to the amplifying horn.Type: ApplicationFiled: June 3, 2003Publication date: December 9, 2004Applicant: ASM Assembly Automation Ltd.Inventors: Hing Leung Marchy Li, Kin Yik Hung, Ming Wai Kelvin Ng
-
Publication number: 20040003891Abstract: The invention provides an apparatus and method for the application of adhesive substances to objects, such as solder balls, for the purpose of mounting them onto substrates. The apparatus comprises an applicator having a layer of the adhesive substance and a pick carrier to carry objects and move the objects from a supply source to a substrate for mounting the objects thereon. The applicator is located so that the applicator applies the adhesive substance to the objects while the objects carried on the pick carrier are moving between the supply source and the substrate.Type: ApplicationFiled: July 2, 2002Publication date: January 8, 2004Applicant: ASM Assembly Automation Ltd.Inventors: Chi Wah Cheng, Kin Yik Hung, Ping Chun (Benson) Chong, See Lok Chan