Patents by Inventor King Gonzalez

King Gonzalez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package substrate dynamic pressure structure
    Patent number: 9111929
    Abstract: Devices and methods for their formation, including electronic assemblies having a shape memory material structure, are described. In one embodiment, a device includes a package substrate and an electronic component coupled to the package substrate. The device also includes a shape memory material structure coupled to the package substrate. In one aspect of certain embodiments, the shape memory material structure is formed from a material selected to have a martensite to austenite transition temperature in the range of 50-300 degrees Celsius. In another aspect of certain embodiments, the shape memory material structure is positioned to extend around a periphery of the electronic component. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 28, 2013
    Date of Patent: August 18, 2015
    Assignee: INTEL CORPORATION
    Inventors: Stewart M. Ongchin, King Gonzalez, Vadim Sherman, Stephen Tisdale, Xiaoqing Ma
  • PACKAGE SUBSTRATE DYNAMIC PRESSURE STRUCTURE
    Publication number: 20140113409
    Abstract: Devices and methods for their formation, including electronic assemblies having a shape memory material structure, are described. In one embodiment, a device includes a package substrate and an electronic component coupled to the package substrate. The device also includes a shape memory material structure coupled to the package substrate. In one aspect of certain embodiments, the shape memory material structure is formed from a material selected to have a martensite to austenite transition temperature in the range of 50-300 degrees Celsius. In another aspect of certain embodiments, the shape memory material structure is positioned to extend around a periphery of the electronic component. Other embodiments are described and claimed.
    Type: Application
    Filed: December 28, 2013
    Publication date: April 24, 2014
    Inventors: Stewart M. ONGCHIN, King GONZALEZ, Vadim SHERMAN, Stephen TISDALE, Xiaoqing MA
  • Package substrate dynamic pressure structure
    Patent number: 8617921
    Abstract: Devices and methods for their formation, including electronic assemblies having a shape memory material structure, are described. In one embodiment, a device includes a package substrate and an electronic component coupled to the package substrate. The device also includes a shape memory material structure coupled to the package substrate. In one aspect of certain embodiments, the shape memory material structure is formed from a material selected to have a martensite to austenite transition temperature in the range of 50-300 degrees Celsius. In another aspect of certain embodiments, the shape memory material structure is positioned to extend around a periphery of the electronic component. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 19, 2012
    Date of Patent: December 31, 2013
    Assignee: Intel Corporation
    Inventors: Stewart M. Ongchin, King Gonzalez, Vadim Sherman, Stephen Tisdale, Xiaoqing Ma
  • PACKAGE SUBSTRATE DYNAMIC PRESSURE STRUCTURE
    Publication number: 20120174385
    Abstract: Devices and methods for their formation, including electronic assemblies having a shape memory material structure, are described. In one embodiment, a device includes a package substrate and an electronic component coupled to the package substrate. The device also includes a shape memory material structure coupled to the package substrate. In one aspect of certain embodiments, the shape memory material structure is formed from a material selected to have a martensite to austenite transition temperature in the range of 50-300 degrees Celsius. In another aspect of certain embodiments, the shape memory material structure is positioned to extend around a periphery of the electronic component. Other embodiments are described and claimed.
    Type: Application
    Filed: March 19, 2012
    Publication date: July 12, 2012
    Inventors: Stewart ONGCHIN, King GONZALEZ, Vadim SHERMAN, Stephen TISDALE, Xiaoqing MA
  • Package substrate dynamic pressure structure
    Patent number: 8143721
    Abstract: Devices and methods for their formation, including electronic assemblies having a shape memory material structure, are described. In one embodiment, a device includes a package substrate and an electronic component coupled to the package substrate. The device also includes a shape memory material structure coupled to the package substrate. In one aspect of certain embodiments, the shape memory material structure is formed from a material selected to have a martensite to austenite transition temperature in the range of 50-300 degrees Celsius. In another aspect of certain embodiments, the shape memory material structure is positioned to extend around a periphery of the electronic component. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 29, 2007
    Date of Patent: March 27, 2012
    Assignee: Intel Corporation
    Inventors: Stewart M. Ongchin, King Gonzalez, Vadim Sherman, Stephen Tisdale, Xiaoqing Ma
  • Apparatus and system for an IC substrate, socket, and assembly
    Patent number: 7518222
    Abstract: An apparatus and system including a substrate having a plurality of through-holes therethrough, and an integrated circuit (IC) socket frame to mount to the substrate. The IC socket frame may include a plurality of beam features, each extending from a socket frame body and corresponding in arrangement to the plurality of through-holes through the substrate.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: April 14, 2009
    Assignee: Intel Corporation
    Inventors: Xiaoqing Ma, King Gonzalez, Stewart Ongchin, Stephen Tisdale, Vadim Sherman
  • PACKAGE SUBSTRATE DYNAMIC PRESSURE STRUCTURE
    Publication number: 20090001564
    Abstract: Devices and methods for their formation, including electronic assemblies having a shape memory material structure, are described. In one embodiment, a device includes a package substrate and an electronic component coupled to the package substrate. The device also includes a shape memory material structure coupled to the package substrate. In one aspect of certain embodiments, the shape memory material structure is formed from a material selected to have a martensite to austenite transition temperature in the range of 50-300 degrees Celsius. In another aspect of certain embodiments, the shape memory material structure is positioned to extend around a periphery of the electronic component. Other embodiments are described and claimed.
    Type: Application
    Filed: June 29, 2007
    Publication date: January 1, 2009
    Inventors: Stewart Ongchin, King Gonzalez, Vadin Sherman, Stephen Tisdale, Xiaoqing Ma
  • Apparatus and system for an IC substrate, socket, and assembly
    Publication number: 20070228531
    Abstract: An apparatus and system including a substrate having a plurality of through-holes therethrough, and an integrated circuit (IC) socket frame to mount to the substrate. The IC socket frame may include a plurality of beam features, each extending from a socket frame body and corresponding in arrangement to the plurality of through-holes through the substrate.
    Type: Application
    Filed: March 30, 2006
    Publication date: October 4, 2007
    Inventors: Xiaoqing Ma, King Gonzalez, Stewart Ongchin, Stephen Tisdale, Vadim Sherman