Patents by Inventor King-Ho Ping

King-Ho Ping has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6005385
    Abstract: A test board circuit for testing integrated circuit modules under stress conditions, such as temperature, humidity, and bias. The integrated circuit module under test is plugged into a test socket which is part of the test board circuit. Without protection electrical shorting between test socket contacts, either from improper plugging of the module under test or from the formation of conductive deposits on the socket contacts, causes erroneous results and can damage devices in the integrated circuit module under test. The test board circuit protects the devices in the integrated circuit module under test from damage due to shorting between test socket contacts and provides a voltage signal which can be used to detect when a short has occurred.
    Type: Grant
    Filed: June 24, 1996
    Date of Patent: December 21, 1999
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: King-Ho Ping
  • Patent number: 5752771
    Abstract: An apparatus to retain integrated circuit modules during the preparation for a cycling of temperature, during the cycling of temperature, and during the post-handling after the cycling of temperature, is described. The apparatus has a specimen basket to contain the integrated circuit modules, a plurality of specimen retaining rods coupled to the specimen basket to prevent the integrated circuit modules from movement within the basket, a plurality of integrated circuit module retaining means coupled to the specimen retaining rods to secure each of the integrated circuit modules within the specimen basket, and a specimen securing rod retaining means to fasten each of the specimen retaining rods to the specimen basket.
    Type: Grant
    Filed: December 9, 1996
    Date of Patent: May 19, 1998
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: King-Ho Ping, Jin-Yuan Lee
  • Patent number: 5659245
    Abstract: A burn-in board assembly for the protection of integrated circuit modules from Electrostatic discharge and the shielding of said integrated circuit modules from Electromagnetic Interference during said electrostatic discharge is described. The burn-in board assembly has a printed circuit board onto which the integrated circuits are mounted by soldering or plugging into sockets soldered to said burnin board assembly. Disposed upon the printed circuit board is a plurality of input stimuli, feedback sensing, and output response signal traces to connect the integrated circuit modules to a connector that is coupled to a input stimulus generator and feedback sensing and output response monitor. Also disposed upon the printed circuit board is a plurality of ground traces and voltage supply traces to connect the integrated circuit modules to the connector that is coupled to a voltage supply source and the system ground reference point.
    Type: Grant
    Filed: June 3, 1996
    Date of Patent: August 19, 1997
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: King-Ho Ping, Jian-Hsing Lee
  • Patent number: 5610081
    Abstract: An apparatus to retain integrated circuit modules during the preparation for a cycling of temperature, during the cycling of temperature, and during the post-handling after the cycling of temperature, is described. The apparatus has a specimen basket to contain the integrated circuit modules, a plurality of specimen retaining rods coupled to the specimen basket to prevent the integrated circuit modules from movement within the basket, a plurality of integrated circuit module retaining means coupled to the specimen retaining rods to secure each of the integrated circuit modules within in the specimen basket, and a specimen securing rod retaining means to fasten each of the specimen retaining rods to the specimen basket.
    Type: Grant
    Filed: June 3, 1996
    Date of Patent: March 11, 1997
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd
    Inventors: King-Ho Ping, Jin-Yuan Lee