Patents by Inventor King Keong Wong

King Keong Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Embedding thin film resistors in substrates in power delivery networks
    Patent number: 8228680
    Abstract: Using die side capacitors and embedded resistors, an advantageous power delivery network may be achieved. In some embodiments, the embedded resistors may be more precisely controllable. The number of die side capacitors may be reduced by combining embedded resistors with these capacitors to reduce costs. The embedded resistors may be provided within the metallization layers either at an upper layer or a lower layer, as two examples.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: July 24, 2012
    Assignee: Intel Corporation
    Inventors: Myitzu Soe Myat, Mooi Ling Chang, Eu Soon Lee, Yongki Min, King Keong Wong
  • Reference layer openings
    Patent number: 7804694
    Abstract: A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.
    Type: Grant
    Filed: January 13, 2009
    Date of Patent: September 28, 2010
    Assignee: Intel Corporation
    Inventors: Kok-Siang Ng, King Keong Wong, Michael E. Ryan
  • Embedding Thin Film Resistors in Substrates in Power Delivery Networks
    Publication number: 20100134992
    Abstract: Using die side capacitors and embedded resistors, an advantageous power delivery network may be achieved. In some embodiments, the embedded resistors may be more precisely controllable. The number of die side capacitors may be reduced by combining embedded resistors with these capacitors to reduce costs. The embedded resistors may be provided within the metallization layers either at an upper layer or a lower layer, as two examples.
    Type: Application
    Filed: February 4, 2010
    Publication date: June 3, 2010
    Inventors: Myitzu Soe Myat, Mooi Ling Chang, Eu Soon Lee, Yongki Min, King Keong Wong
  • REFERENCE LAYER OPENINGS
    Publication number: 20090126978
    Abstract: A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.
    Type: Application
    Filed: January 13, 2009
    Publication date: May 21, 2009
    Inventors: Kok-Siang Ng, King Keong Wong, Michael E. Ryan
  • Reference layer openings
    Patent number: 7495929
    Abstract: A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: February 24, 2009
    Assignee: Intel Corporation
    Inventors: Kok-Siang Ng, King Keong Wong, Michael E. Ryan
  • REFERENCE LAYER OPENINGS
    Publication number: 20080006439
    Abstract: A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.
    Type: Application
    Filed: September 20, 2007
    Publication date: January 10, 2008
    Inventors: Kok-Siang Ng, King Keong Wong, Michael Ryan
  • Reference layer openings
    Patent number: 7292452
    Abstract: A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.
    Type: Grant
    Filed: June 10, 2004
    Date of Patent: November 6, 2007
    Assignee: Intel Corporation
    Inventors: Kok-Siang Ng, King Keong Wong, Michael E. Ryan