Patents by Inventor King-Lien Lee

King-Lien Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9080850
    Abstract: A touch and proximity sensing device includes a circuit board and a sensed signal processing unit including only one sensed signal conversion engine. The circuit board includes a capacitor sensing electrode and a grounding conductor foil disposed on opposite surfaces of the circuit board, and has a proximity sensing electrode formed thereon. The grounding conductor foil is spaced apart from the proximity sensing electrode in a planar direction parallel to the surfaces of the circuit board. The sensed signal conversion engine is spaced apart from the capacitor sensing electrode and the proximity sensing electrode in the planar direction and detects electric sensed signals from the capacitor sensing electrode and the proximity sensing electrode.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: July 14, 2015
    Assignee: Ene Technology Inc.
    Inventors: Chao-Ming Lee, King-Lien Lee
  • Publication number: 20140097768
    Abstract: A touch and proximity sensing device includes a circuit board and a sensed signal processing unit including only one sensed signal conversion engine. The circuit board includes a capacitor sensing electrode and a grounding conductor foil disposed on opposite surfaces of the circuit board, and has a proximity sensing electrode formed thereon. The grounding conductor foil is spaced apart from the proximity sensing electrode in a planar direction parallel to the surfaces of the circuit board. The sensed signal conversion engine is spaced apart from the capacitor sensing electrode and the proximity sensing electrode in the planar direction and detects electric sensed signals from the capacitor sensing electrode and the proximity sensing electrode.
    Type: Application
    Filed: March 8, 2013
    Publication date: April 10, 2014
    Applicant: ENE TECHNOLOGY INC.
    Inventors: Chao-Ming Lee, King-Lien Lee
  • Publication number: 20120305301
    Abstract: The invention provides a circuit board with heat sink and a method of fabricating the same. The circuit board according to the invention includes a substrate, a lead layer and a ceramic layer. The lead layer is formed on an upper surface of the substrate, and includes two contact points corresponding to an electronic device. The ceramic layer is formed on the upper surface of the substrate, and particularly formed between such two contact points. The ceramic layer serves as a heat sink for the electronic device.
    Type: Application
    Filed: February 17, 2012
    Publication date: December 6, 2012
    Applicant: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY
    Inventor: King-Lien Lee