Abstract: A charge trapping semiconductor device is particularly suited as a replacement for conventional pull-up and load elements such as NDR diodes, passive resistors, and conventional FETs. The device includes a charge trapping layer formed at or extremely near to an interface between a substrate (which can be silicon or SOI) and a gate insulation layer. The charge trapping device can be shut off during static operations to further reduce power dissipation.

Abstract: A negative differential resistance device is disclosed which is particularly suited as a replacement for conventional pull-up and load elements such as NDR diodes, passive resistors, and conventional FETs. The NDR device includes a charge trapping layer formed at or extremely near to an interface between a substrate (which can be silicon or SOI) and a gate insulation layer. The NDR device can be shut off during static operations to further reduce power dissipation.

Abstract: An improved MISFET is disclosed which is particularly suited as a replacement for conventional pull-up and load elements such as NDR diodes, passive resistors, and conventional FETs. The MISFET includes a charge trapping layer formed at or extremely near to an interface between a substrate (which can be silicon or SOI) and a gate insulation layer. In this fashion, charge traps can be optimized for extremely rapid trapping and de-trapping of charge because they are extremely close to a channel of hot carriers. The MISFET channel can be shut off during static operations to further reduce power dissipation, and can also be adapted to operate with negative differential resistance.

Abstract: An integrated circuit device includes a charge pump for providing a bias signal to a field effect transistor (FET) that is capable of operating in a negative differential resistance mode. The bias signal is applied to a gate of the NDR FET to control the characteristics of the NDR behavior.

Abstract: An improved negative differential resistance field effect transistor (NDR-FET) is disclosed. The NDR FET includes a charge trapping layer formed at or extremely near to an interface between a substrate (which can be silicon or SOI) and a gate insulation layer. In this fashion, charge traps can be optimized for extremely rapid trapping and de-trapping of charge because they are extremely close to a channel of hot carriers. The NDR-FET is also useable as a replacement for conventional NDR diode and similar devices in memory cells, and enables an entire family of logic circuits that only require a single channel technology (i.e., instead of CMOS) and yet which provide low power.

Abstract: An improved negative differential resistance field effect transistor (NDR-FET) is disclosed. The NDR FET includes a charge trapping layer formed at or extremely near to an interface between a substrate (which can be silicon or SOI) and a gate insulation layer. In this fashion, charge traps can be optimized for extremely rapid trapping and de-trapping of charge because they are extremely close to a channel of hot carriers. The NDR-FET is also useable as a replacement for conventional NDR diode and similar devices in memory cells, and enables an entire family of logic circuits that only require a single channel technology (i.e., instead of CMOS) and yet which provide low power.

Abstract: An integrated circuit device includes a charge pump for providing a bias signal to a field effect transistor (FET) that is capable of operating in a negative differential resistance mode. The bias signal is applied to a gate of the NDR FET to control the characteristics of the NDR behavior.