Patents by Inventor King Wai Chiu Lai

King Wai Chiu Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11614375
    Abstract: An electromechanical sensor includes: an elastic carrier arranged to extend when subjected to an external mechanical load; a sensing sheath arranged at least partially around and along the elastic carrier; wherein the sensing sheath includes an electrically resistive element having a first electrical resistance operable to change upon a change of a dimension of the elastic carrier.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: March 28, 2023
    Assignee: City University of Hong Kong
    Inventors: King Wai Chiu Lai, Xiaoting Li
  • Publication number: 20210190614
    Abstract: An electromechanical sensor includes: an elastic carrier arranged to extend when subjected to an external mechanical load; a sensing sheath arranged at least partially around and along the elastic carrier; wherein the sensing sheath includes an electrically resistive element having a first electrical resistance operable to change upon a change of a dimension of the elastic carrier.
    Type: Application
    Filed: December 19, 2019
    Publication date: June 24, 2021
    Inventors: King Wai Chiu Lai, Xiaoting Li
  • Publication number: 20150042764
    Abstract: A method is provided for constructing a three-dimensional hyperspectral image using compressive sensing. The method includes: configuring on/off state of each mirror in an array of micromirrors in accordance with a pattern; capturing image data of a scene from a first point of view using a first photodetector; and capturing image data of the scene from second point of view using a second photodetector, where second point of view differs from the first point of view. The steps are repeated to obtain a series of measurement samples, where the array of micromirrors is configured in accordance with a pattern that differs amongst each measurement samples. By choosing different photodetectors with different band gap nanomaterials, the first and second photodetectors detects photons in the electromagnetic spectrum. As a result, the three-dimensional image also carry the spectrum information of the scene.
    Type: Application
    Filed: August 4, 2014
    Publication date: February 12, 2015
    Inventors: Ning Xi, King Wai Chiu Lai, Hongzhi Chen, LiangLiang Chen, Bo Song