Patents by Inventor King Yi Heung
King Yi Heung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200282506Abstract: A method is provided to minimize travel distance and time between correction locations on a substrate when polishing a local area of a substrate, such as a semiconductor wafer, using a location specific polishing module. A correction profile is determined and a recipe based on the correction profile is used to polish a substrate. A polishing pad assembly traverses between a first correction location and a second correction location using the combined motion of a substrate support chuck and a support arm coupled at a first end thereof to the polishing pad assembly. The chuck rotates about a center axis thereof. The positioning arm may sweep about a vertical axis disposed through a second end of the support arm. The combined motion of the chuck and the positioning arm causes the polishing pad assembly to form a spiral shaped polishing path on the substrate.Type: ApplicationFiled: May 22, 2020Publication date: September 10, 2020Inventors: Eric LAU, Chih Chung CHOU, Charles C. GARRETSON, Jeonghoon OH, King Yi HEUNG
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Patent number: 10610994Abstract: A polishing module includes a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.Type: GrantFiled: March 10, 2017Date of Patent: April 7, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Eric Lau, Hui Chen, King Yi Heung, Chih Chung Chou, Edwin C. Suarez, Garrett Ho Yee Sin, Charles C. Garretson, Jeonghoon Oh
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Patent number: 10589399Abstract: A chemical mechanical polishing system includes a substrate support configured to hold a substrate, a polishing pad assembly include a membrane and a polishing pad portion having a polishing surface, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad portion is joined to the membrane on a side opposite the polishing surface. The polishing surface has a width parallel to the polishing surface at least four times smaller than a diameter of the substrate. An outer surface of the polishing pad portion includes at least one recess and at least one plateau having a top surface that provides the polishing surface. The polishing surface has a plurality of edges defined by intersections between side walls of the at least one recess and a top surface of the at least one plateau.Type: GrantFiled: March 17, 2017Date of Patent: March 17, 2020Assignee: Applied Materials, Inc.Inventors: Jeonghoon Oh, Edwin C. Suarez, Jason Garcheung Fung, Eric Lau, King Yi Heung, Ashwin Murugappan Chockalingam, Daniel Redfield, Charles C. Garretson, Thomas H. Osterheld
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Patent number: 10493590Abstract: Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.Type: GrantFiled: December 14, 2015Date of Patent: December 3, 2019Assignee: Applied Materials, Inc.Inventors: Huanbo Zhang, Garrett Ho Yee Sin, King Yi Heung, Nathan Bohannon, Qing Zhang
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Patent number: 10434623Abstract: A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in one or more of a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.Type: GrantFiled: March 10, 2017Date of Patent: October 8, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Eric Lau, Hui Chen, King Yi Heung, Wei-Cheng Lee, Chih Chung Chou, Edwin C. Suarez, Garrett Ho Yee Sin, Charles C. Garretson, Jeonghoon Oh
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Patent number: 10256111Abstract: A method for polishing dies locations on a substrate with a polishing module. A thickness at selected locations on the substrate is premeasured at a metrology station, each location corresponding to a location of a single die. The thickness obtained by the metrology station for the selected locations of the substrate is provided to a controller of a polishing module. The thickness corrections for each selected location on the substrate are determined. A polishing step in a polishing recipe is formed from the thickness correction for each selected location. A polishing parameter for each die location is calculated for the recipe.Type: GrantFiled: June 13, 2017Date of Patent: April 9, 2019Assignee: Applied Materials, Inc.Inventors: Eric Lau, King Yi Heung, Charles C. Garretson, Jun Qian, Thomas H. Osterheld, Shuchivrat Datar, David Chui
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Publication number: 20180250788Abstract: A method is provided to minimize travel distance and time between correction locations on a substrate when polishing a local area of a substrate, such as a semiconductor wafer, using a location specific polishing module. A correction profile is determined and a recipe based on the correction profile is used to polish a substrate. A polishing pad assembly traverses between a first correction location and a second correction location using the combined motion of a substrate support chuck and a support arm coupled at a first end thereof to the polishing pad assembly. The chuck rotates about a center axis thereof. The positioning arm may sweep about a vertical axis disposed through a second end of the support arm. The combined motion of the chuck and the positioning arm causes the polishing pad assembly to form a spiral shaped polishing path on the substrate.Type: ApplicationFiled: February 8, 2018Publication date: September 6, 2018Inventors: Eric LAU, Chih Chung CHOU, Charles C. GARRETSON, Jeonghoon OH, King Yi HEUNG
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Publication number: 20180005842Abstract: A method for polishing dies locations on a substrate with a polishing module. A thickness at selected locations on the substrate is premeasured at a metrology station, each location corresponding to a location of a single die. The thickness obtained by the metrology station for the selected locations of the substrate is provided to a controller of a polishing module. The thickness corrections for each selected location on the substrate are determined. A polishing step in a polishing recipe is formed from the thickness correction for each selected location. A polishing parameter for each die location is calculated for the recipe.Type: ApplicationFiled: June 13, 2017Publication date: January 4, 2018Inventors: Eric LAU, King Yi HEUNG, Charles C. GARRETSON, Jun QIAN, Thomas H. OSTERHELD, Shuchivrat DATAR, David CHUI
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Publication number: 20170274497Abstract: A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in one or more of a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.Type: ApplicationFiled: March 10, 2017Publication date: September 28, 2017Inventors: Eric LAU, Hui CHEN, King Yi HEUNG, Wei-Cheng LEE, Chih Chung CHOU, Edwin C. SUAREZ, Garrett Ho Yee SIN, Charles C. GARRETSON, Jeonghoon OH
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Publication number: 20170274498Abstract: A chemical mechanical polishing system includes a substrate support configured to hold a substrate, a polishing pad assembly include a membrane and a polishing pad portion having a polishing surface, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad portion is joined to the membrane on a side opposite the polishing surface. The polishing surface has a width parallel to the polishing surface at least four times smaller than a diameter of the substrate. An outer surface of the polishing pad portion includes at least one recess and at least one plateau having a top surface that provides the polishing surface. The polishing surface has a plurality of edges defined by intersections between side walls of the at least one recess and a top surface of the at least one plateau.Type: ApplicationFiled: March 17, 2017Publication date: September 28, 2017Inventors: Jeonghoon Oh, Edwin C. Suarez, Jason Garcheung Fung, Eric Lau, King Yi Heung, Ashwin Murugappan Chockalingam, Daniel Redfield, Charles C. Garretson, Thomas H. Osterheld
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Publication number: 20170274495Abstract: A polishing module includes a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.Type: ApplicationFiled: March 10, 2017Publication date: September 28, 2017Inventors: Eric LAU, Hui CHEN, King Yi HEUNG, Chih Chung CHOU, Edwin C. SUAREZ, Garrett Ho Yee SIN, Charles C. GARRETSON, Jeonghoon OH
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Publication number: 20160096251Abstract: Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.Type: ApplicationFiled: December 14, 2015Publication date: April 7, 2016Applicant: Applied Materials, Inc.Inventors: Huanbo Zhang, Garrett Ho Yee Sin, King Yi Heung, Nathan Bohannon, Qing Zhang
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Patent number: 9213340Abstract: Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.Type: GrantFiled: June 2, 2014Date of Patent: December 15, 2015Assignee: Applied Materials, Inc.Inventors: Huanbo Zhang, Garrett Ho Yee Sin, King Yi Heung, Nathan Bohannon, Qing Zhang
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Publication number: 20140277670Abstract: Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.Type: ApplicationFiled: June 2, 2014Publication date: September 18, 2014Applicant: Applied Materials, Inc.Inventors: Huanbo Zhang, Garrett Ho Yee Sin, King Yi Heung, Nathan Bohannon, Qing Zhang
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Patent number: 8774958Abstract: Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.Type: GrantFiled: April 29, 2011Date of Patent: July 8, 2014Assignee: Applied Materials, Inc.Inventors: Huanbo Zhang, Garrett Ho Yee Sin, King Yi Heung, Nathan Bohannon, Qing Zhang
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Publication number: 20120277897Abstract: Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.Type: ApplicationFiled: April 29, 2011Publication date: November 1, 2012Inventors: Huanbo Zhang, Garrett Ho Yee Sin, King Yi Heung, Nathan Bohannon, Qing Zhang