Patents by Inventor King Yip Leung

King Yip Leung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for forming engineered thermal paths of printed circuit boards by use of removable layers
    Patent number: 12262464
    Abstract: A method for forming a thermal and electrical path in a PCB may include forming a first removable layer over a top surface of a PCB and a second removable layer over a bottom surface of the PCB. The method may also include milling or laser drilling the PCB from the top surface to form a first cavity extending into the PCB, plating the first side panel plating the first side with a second metal to partially fill the first cavity; and milling or laser drilling from the bottom surface to form a second cavity extending into the PCB, the first cavity in a thermal communication and/or an electrical communication with the second cavity. The method may also include panel plating the first side with a second metal to fill the first cavity and the second side with the second metal to fill the second cavity, and removing the first and second removable layers from the PCB to form the PCB with a thermal and/or an electrical path comprising the first cavity and the second cavity filled with the second metal.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: March 25, 2025
    Inventors: Matthew D. Neely, Michael Len, King Yip Leung
  • DEVICES AND METHODS FOR FORMING ENGINEERED THERMAL PATHS OF PRINTED CIRCUIT BOARDS BY USE OF REMOVABLE LAYERS
    Publication number: 20220183141
    Abstract: A method for forming a thermal and electrical path in a PCB may include forming a first removable layer over a top surface of a PCB and a second removable layer over a bottom surface of the PCB. The method may also include milling or laser drilling the PCB from the top surface to form a first cavity extending into the PCB, plating the first side panel plating the first side with a second metal to partially fill the first cavity; and milling or laser drilling from the bottom surface to form a second cavity extending into the PCB, the first cavity in a thermal communication and/or an electrical communication with the second cavity. The method may also include panel plating the first side with a second metal to fill the first cavity and the second side with the second metal to fill the second cavity, and removing the first and second removable layers from the PCB to form the PCB with a thermal and/or an electrical path comprising the first cavity and the second cavity filled with the second metal.
    Type: Application
    Filed: December 6, 2021
    Publication date: June 9, 2022
    Inventors: Matthew D. Neely, Michael Len, King Yip Leung