Patents by Inventor Kinga HAUBNER

Kinga HAUBNER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal or metal alloy deposition composition and plating compound
    Patent number: 11512405
    Abstract: The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: November 29, 2022
    Assignee: Atotech Deutschland GmbH
    Inventors: Angela Llavona-Serrano, Timo Bangerter, Olivier Mann, Pamela Cebulla, Stefanie Ackermann, Heiko Brunner, Kinga Haubner, Bernd Froese
  • METAL OR METAL ALLOY DEPOSITION COMPOSITION AND PLATING COMPOUND
    Publication number: 20200340132
    Abstract: The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.
    Type: Application
    Filed: December 14, 2018
    Publication date: October 29, 2020
    Inventors: Angela LLAVONA-SERRANO, Timo BANGERTER, Olivier MANN, Pamela CEBULLA, Stefanie ACKERMANN, Heiko BRUNNER, Kinga HAUBNER, Bernd FROESE