Patents by Inventor Kingshuk Banerj

Kingshuk Banerj has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with controlled spread polymeric underfill
    Patent number: 5218234
    Abstract: A semiconductor device assembly comprises a semiconductor device (10) attached to a substrate (20). The substrate has a metallization pattern (22) on the surface and a polymeric film (24) covering most of the surface and the metallization pattern. A window-frame shaped opening (26) is created in the film, exposing portions of the substrate surface. The semiconductor device is attached to the substrate in such a manner that it lies in the interior perimeter (28) of the window-frame shaped opening in the film. An adhesive material (18) is applied to fill the space between the semiconductor device and the substrate. The window frame opening in the polymeric film serves to confine the adhesive to the area in the opening and underneath the device and prevents unwanted spread of the underfill material by forming an ideal fillet geometry. In another embodiment of the invention, the semiconductor device is in a package and the package is attached directly to the substrate.
    Type: Grant
    Filed: December 23, 1991
    Date of Patent: June 8, 1993
    Assignee: Motorola, Inc.
    Inventors: Kenneth R. Thompson, Kingshuk Banerj, Francisco da Costa Alves