Patents by Inventor Kinpei Iwata

Kinpei Iwata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Curable resin composition, adhesive composition, cured product and composite
    Patent number: 6420467
    Abstract: A curable resin composition comprising: (1) a compound having a structure of the formula (A) and/or (B): R2—OOC—R1—COO—R2′  (A)  wherein R1 is —(CH2)n— (wherein n is from 4 to 6), or an o-, m- or p-phenylene group, and each of R2 and R2′ is a C1-10 alkyl group,  wherein R3 is a C1-4 alkyl group, (2) a polymerizable vinyl monomer, (3) an organic peroxide, (4) a reducing agent, and (5) an elastomer component.
    Type: Grant
    Filed: June 24, 1998
    Date of Patent: July 16, 2002
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Nobuyuki Ohtsuka, Kinpei Iwata, Hideyuki Takahashi, Koichi Taguchi
  • Adhesive composition and metal-bonded composite
    Patent number: 5330844
    Abstract: An adhesive composition comprising an acrylate monomer and/or a methacrylate monomer, an organic peroxide and a reducing agent, which contains zeolite or calcium oxide.
    Type: Grant
    Filed: December 27, 1991
    Date of Patent: July 19, 1994
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Koichi Taguchi, Kinpei Iwata
  • Two-part adhesive
    Patent number: 5328947
    Abstract: A two-part adhesive consisting of a first liquid comprising 100 parts by weight of a polymerizable vinyl monomer and from 0.1 to 20 parts by weight of an organic peroxide and a second liquid comprising 100 parts by weight of a polymerizable vinyl monomer and from 0.05 to 15 parts by weight of a reducing agent, wherein either one or both of the first and second liquids contain from 0.4 to 5% by weight of water, and the content of water is more than 0.2% by weight based on the total amount of the first and second liquids.
    Type: Grant
    Filed: December 23, 1992
    Date of Patent: July 12, 1994
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Koichi Taguchi, Kinpei Iwata, Hideki Matsudo
  • Two-part adhesive
    Patent number: RE36140
    Abstract: A two-part adhesive consisting of a first liquid comprising 100 parts by weight of a polymerizable vinyl monomer and from 0.1 to 20 parts by weight of an organic peroxide and a second liquid comprising 100 parts by weight of a polymerizable vinyl monomer and from 0.05 to 15 parts by weight of a reducing agent, wherein either one or both of the first and second liquids contain from 0.4 to 5% by weight of water, and the content of water is more than 0.2% by weight based on the total amount of the first and second liquids.
    Type: Grant
    Filed: February 29, 1996
    Date of Patent: March 9, 1999
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Koichi Taguchi, Kinpei Iwata, Hideki Matsudo