Patents by Inventor Kinya Aoki

Kinya Aoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor composite device and package board used therein
    Patent number: 11552020
    Abstract: A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: January 10, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Koshi Himeda, Tatsuya Kitamura, Chiharu Sakaki, Shinya Kiyono, Sho Fujita, Atsushi Yamamoto, Takeshi Furukawa, Kenji Nishiyama, Tatsuya Funaki, Kinya Aoki
  • SEMICONDUCTOR COMPOSITE DEVICE AND PACKAGE BOARD USED THEREIN
    Publication number: 20210375841
    Abstract: A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.
    Type: Application
    Filed: August 10, 2021
    Publication date: December 2, 2021
    Inventors: Koshi Himeda, Tatsuya Kitamura, Chiharu Sakaki, Shinya Kiyono, Sho Fujita, Atsushi Yamamoto, Takeshi Furukawa, Kenji Nishiyama, Tatsuya Funaki, Kinya Aoki
  • Semiconductor composite device and package board used therein
    Patent number: 11121123
    Abstract: A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: September 14, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Koshi Himeda, Tatsuya Kitamura, Chiharu Sakaki, Shinya Kiyono, Sho Fujita, Atsushi Yamamoto, Takeshi Furukawa, Kenji Nishiyama, Tatsuya Funaki, Kinya Aoki
  • SEMICONDUCTOR COMPOSITE DEVICE AND PACKAGE BOARD USED THEREIN
    Publication number: 20200321323
    Abstract: A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.
    Type: Application
    Filed: June 22, 2020
    Publication date: October 8, 2020
    Inventors: Koshi Himeda, Tatsuya Kitamura, Chiharu Sakaki, Shinya Kiyono, Sho Fujita, Atsushi Yamamoto, Takeshi Furukawa, Kenji Nishiyama, Tatsuya Funaki, Kinya Aoki