Abstract: A laminating apparatus for a provisionally laminated body is provided and is configured to form an end laminated body including one of a first resin film and a second resin film conforming to protruding and recessed portions of a substrate. The laminating apparatus may include first and second laminating mechanisms. The first laminating mechanism may include a first enclosed space forming receiver, a depressurizer, a heater, and a first pressure laminator to form an intermediate laminated body from the provisionally laminated body. The second laminating mechanism may include a second enclosed space forming receiver, and a second pressure laminator to form the end laminated body from the intermediate laminated body.

Abstract: An addition/condensation curable silicone resin sheet comprising (A) an organopolysiloxane containing at least two silicon-bonded alkenyl groups and at least two silicon-bonded alkoxy or hydroxyl groups, (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms and at least two silicon-bonded alkoxy or hydroxyl groups, (C) an organopolysiloxane containing at least two silicon atoms having two alkoxy or hydroxyl groups and one hydrogen atom on a common silicon atom, and (D) a hydrosilylation catalyst is plastic and solid or semisolid at normal temperature. The silicone resin sheet is easy to work, effective to cure, and likely to form a cured layer around an LED chip.

Abstract: An addition/condensation curable silicone resin sheet comprising (A) an organopolysiloxane containing at least two silicon-bonded alkenyl groups and at least two silicon-bonded alkoxy or hydroxyl groups, (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms and at least two silicon-bonded alkoxy or hydroxyl groups, (C) an organopolysiloxane containing at least two silicon atoms having two alkoxy or hydroxyl groups and one hydrogen atom on a common silicon atom, and (D) a hydrosilylation catalyst is plastic and solid or semisolid at normal temperature. The silicone resin sheet is easy to work, effective to cure, and likely to form a cured layer around an LED chip.

Abstract: A laminating apparatus for a provisionally laminated body is provided and is configured to form an end laminated body including one of a first resin film and a second resin film conforming to protruding and recessed portions of a substrate. The laminating apparatus may include first and second laminating mechanisms. The first laminating mechanism may include a first enclosed space forming receiver, a depressurizer, a heater, and a first pressure laminator to form an intermediate laminated body from the provisionally laminated body. The second laminating mechanism may include a second enclosed space forming receiver, and a second pressure laminator to form the end laminated body from the intermediate laminated body.

Abstract: A laminating apparatus is provided which causes a resin film to completely conform to protruding and recessed portions of a substrate, and which makes the film thickness of the conforming resin film uniform on a stricter level. To this end, the laminating apparatus includes a laminating mechanism including: an enclosed space forming receiver capable of receiving a provisionally laminated body therein; and a pressure laminator for applying pressure to the provisionally laminated body in non-contacting relationship in an enclosed space formed by the enclosed space forming receiver to form an end laminated body from the provisionally laminated body.

Abstract: The invention provides a curable silicone resin composition comprising: (A) an organopolysiloxane containing an aromatic group having two or more alkenyl groups, and having a viscosity at 25° C. of 10 to 1,000,000 mPa·s, (B) an organopolysiloxane having a resin structure, comprising 10 to 80 mol % of a SiO4/2 unit, 1 to 80 mol % of a (R1)2SiO2/2 unit, and 1 to 60 mol % of a (R2)3SiO1/2 unit, and containing a SiOH group in a range of 0.1 to 5.0 mol %, (C) an organohydrogenpolysiloxane having two or more SiH group, and among whole substituents bonded to the silicon atom, 20 to 80 mol % is a phenyl group, and a SiO4/2 unit is less than 5 mol %, and (D) a platinum group metal catalyst, and the component (B) is contained in an amount of 20 to 80% by mass based on a sum of the component (A) and the component (B).

Abstract: The invention provides a curable silicone resin composition comprising: (A) an organopolysiloxane containing an aromatic group having two or more alkenyl groups, and having a viscosity at 25° C. of 10 to 1,000,000 mPa·s, (B) an organopolysiloxane having a resin structure, comprising 10 to 80 mol % of a SiO4/2 unit, 1 to 80 mol % of a (R1)2SiO2/2 unit, and 1 to 60 mol % of a (R2)3SiO1/2 unit, and containing a SiOH group in a range of 0.1 to 5.0 mol %, (C) an organohydrogenpolysiloxane having two or more SiH group, and among whole substituents bonded to the silicon atom, 20 to 80 mol % is a phenyl group, and a SiO4/2 unit is less than 5 mol %, and (D) a platinum group metal catalyst, and the component (B) is contained in an amount of 20 to 80% by mass based on a sum of the component (A) and the component (B).

Abstract: A laminating apparatus is provided which causes a resin film to completely conform to protruding and recessed portions of a substrate, and which makes the film thickness of the conforming resin film uniform on a stricter level. To this end, the laminating apparatus includes a laminating mechanism including: an enclosed space forming receiver capable of receiving a provisionally laminated body therein; and a pressure laminator for applying pressure to the provisionally laminated body in non-contacting relationship in an enclosed space formed by the enclosed space forming receiver to form an end laminated body from the provisionally laminated body.

Abstract: A silicone resin composition and process for coating a light transmitting surface of an optoelectronic device is disclosed. The process involves applying a silicone resin to the light transmitting surface, and causing the silicone resin to cure to form a light transmitting protective coating on the light transmitting surface, the silicone resin having a sufficiently low proportion of organosiloxanes having molecular weights of up to about 1000, such that the protective coating includes less than about 10% of the organosiloxanes having molecular weights of up to about 1000.

Abstract: Provided is a curable silicone rubber composition, including: (A) an organopolysiloxane containing two or more silicon atom-bonded aliphatic unsaturated groups within each molecule, and containing a phenyl group and/or cyclohexyl group, (B) an organopolysiloxane resin with a three dimensional network structure consisting essentially of Q units and M units, and containing one or more phenyl groups and/or cyclohexyl groups, (C) an organohydrogenpolysiloxane, and (D) a platinum group metal-based catalyst, in which the component (B) exists in a quantity that represents from 20 to 80% by mass of the combination of the component (A) and the component (B), and in the component B, the quantity of low molecular weight substances, for which the weight average molecular weight measured by GPC and calculated against polystyrene standards is not greater than 500, is not greater than 5%.

Abstract: An epoxy/silicone hybrid resin composition is provided comprising (A) an organosilicon compound having at least one silicon-bonded hydroxyl group, (B) a modified epoxy resin which is free of a phenylene ether skeleton and has reactive hydroxyl groups wherein some or all of the hydrogen atoms of the reactive hydroxyl groups are substituted by monovalent hydrocarbon groups or silyl groups, and (C) an aluminum base curing catalyst. The compatibility between silicone and epoxy resins is improved without a need for compatibilizing agent.

Abstract: A silicone resin composition and process for coating a light transmitting surface of an optoelectronic device is disclosed. The process involves applying a silicone resin to the light transmitting surface, and causing the silicone resin to cure to form a light transmitting protective coating on the light transmitting surface, the silicone resin having a sufficiently low proportion of organosiloxanes having molecular weights of up to about 1000, such that the protective coating includes less than about 10% of the organosiloxanes having molecular weights of up to about 1000.

Abstract: Provided is a curable silicone rubber composition, including: (A) an organopolysiloxane containing two or more silicon atom-bonded aliphatic unsaturated groups within each molecule, and containing a phenyl group and/or cyclohexyl group, (B) an organopolysiloxane resin with a three dimensional network structure consisting essentially of Q units and M units, and containing one or more phenyl groups and/or cyclohexyl groups, (C) an organohydrogenpolysiloxane, and (D) a platinum group metal-based catalyst, in which the component (B) exists in a quantity that represents from 20 to 80% by mass of the combination of the component (A) and the component (B), and in the component B, the quantity of low molecular weight substances, for which the weight average molecular weight measured by GPC and calculated against polystyrene standards is not greater than 500, is not greater than 5%.

Abstract: An optical waveguide comprising a substrate, a lower clad layer on the substrate, a core layer and an upper clad layer, at least one of the lower clad layer, the core layer and the upper clad layer is formed of a cured product of a photo-curable organopolysiloxane composition comprising (A) a (meth)acryloyloxy group-containing organopolysiloxane of the following average compositional formula (1): (CH2?CR1COO(CH2)n)a(Ph)bR2c(R3O)dSiO(4-a-b-c-d)/2??(1) wherein R1 is hydrogen or methyl, R2 is an C1–C8 alkyl or C2–C8 alkenyl group, Ph is phenyl, R3 is hydrogen or an unsubstituted or alkoxy-substituted C1–C4 alkyl group, subscripts a, b, c and d are numbers satisfying: 0.05?a?0.9, 0.1?b?0.9, 0?c?0.2, 0<d?0.5, and 0.8?a+b+c+d?1.5, and n is an integer of 2 to 5, and having a weight average molecular weight of 1,000 to 100,000 as measured by GPC using a polystyrene standard, and (B) a photosensitizer.

Abstract: In an epoxy/silicone hybrid resin composition comprising (A) an organosilicon compound having at least one silanol group, (B) an epoxy resin free of a phenylene ether skeleton, and (C) an aluminum base curing catalyst, at least one of components (A) and (B) is solid at normal temperature, and the composition is solid at normal temperature. The composition is effectively cast moldable and the cured composition has improved heat resistance and light resistance.

Abstract: An epoxy/silicone hybrid resin composition is provided comprising (A) an organosilicon compound having at least one silicon-bonded hydroxyl group, (B) a modified epoxy resin which is free of a phenylene ether skeleton and has reactive hydroxyl groups wherein some or all of the hydrogen atoms of the reactive hydroxyl groups are substituted by monovalent hydrocarbon groups or silyl groups, and (C) an aluminum base curing catalyst. The compatibility between silicone and epoxy resins is improved without a need for compatibilizing agent.

Abstract: In the preparation of a semiconductor device comprising a semiconductor member, the semiconductor member is subjected to plasma treatment and then primer treatment, prior to the encapsulation thereof with an encapsulant. The semiconductor device, typically LED package, is highly reliable in that a firm bond is established between the semiconductor member and the encapsulant resin.

Abstract: An optical waveguide-forming material is comprised of a photocurable organopolysiloxane composition comprising an alkali-soluble organopolysiloxane and a photoacid generator, wherein the organopolysiloxane is obtained by (co)hydrolytic condensation of a triorganoxysilane having hydrolyzable epoxide and has an average molecular weight of 500–50,000 as determined by GPC using polystyrene standards. The optical waveguide-forming material, when subjected to pattern formation by photolithography, can be resolved with an alkaline aqueous solution, has a high sensitivity and resolution, and offers a cured film having improved light transmittance, heat resistance and humidity resistance.

Abstract: An optical waveguide comprising a substrate, a lower clad layer on the substrate, a core layer and an upper clad layer, at least one of the lower clad layer, the core layer and the upper clad layer is formed of a cured product of a photo-curable organopolysiloxane composition comprising (A) a (meth)acryloyloxy group-containing organopolysiloxane of the following average compositional formula (1): (CH2?CR1COO(CH2)n)a(Ph)bR2c(R3O)dSiO(4-a-b-c-d)/2??(1) wherein R1 is hydrogen or methyl, R2 is an C1-C8 alkyl or C2-C8 alkenyl group, Ph is phenyl, R3 is hydrogen or an unsubstituted or alkoxy-substituted C1-C4 alkyl group, subscripts a, b, c and d are numbers satisfying: 0.05?a?0.9, 0.1?b?0.9, 0?c?0.2, 0<d?0.5, and 0.8?a+b+c+d?1.5, and n is an integer of 2 to 5, and having a weight average molecular weight of 1,000 to 100,000 as measured by GPC using a polystyrene standard, and (B) a photosensitizer.

Abstract: An optical waveguide-forming material is comprised of a photocurable organopolysiloxane composition comprising an alkali-soluble organopolysiloxane and a photoacid generator, wherein the organopolysiloxane is obtained by (co)hydrolytic condensation of a triorganoxysilane having hydrolyzable epoxide and has an average molecular weight of 500-50,000 as determined by GPC using polystyrene standards. The optical waveguide-forming material, when subjected to pattern formation by photolithography, can be resolved with an alkaline aqueous solution, has a high sensitivity and resolution, and offers a cured film having improved light transmittance, heat resistance and humidity resistance.