Patents by Inventor Kinya Nakatsu
Kinya Nakatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120275205Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.Type: ApplicationFiled: July 11, 2012Publication date: November 1, 2012Applicant: Hitachi, Ltd.Inventors: Kinya NAKATSU, Hideyo Suzuki, Fusanori Nishikimi, Takeshi Matsuo, Toshiya Satou
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Patent number: 8240411Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.Type: GrantFiled: May 29, 2009Date of Patent: August 14, 2012Assignee: Hitachi, Ltd.Inventors: Kinya Nakatsu, Hideyo Suzuki, Fusanori Nishikimi, Takeshi Matsuo, Toshiya Satou
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Publication number: 20120200164Abstract: A power conversion apparatus capable of improving the impedance characteristics between each of two power modules and each of a plurality of capacitor cells, the power conversion apparatus including: plural capacitor cells connected in parallel between a three-layer laminated wiring board consisting of a positive polarity conductor board and a negative polarity conductor board formed widely in the direction of the parallel disposition of the power modules and laminated with an insulation sheet therebetween; a three-layer laminated conductor board consisting of a positive polarity conductor board and a negative polarity conductor board formed widely in the direction of the parallel direction of the power modules and laminated with an insulation sheet therebetween and used to connect the positive and negative polarity sides of each of the two power modules to the laminated wiring board respectively.Type: ApplicationFiled: April 12, 2012Publication date: August 9, 2012Applicant: Hitachi, Ltd.Inventors: Kinya NAKATSU, Hideyo Suzuki, Fusanori Nishikimi, Takeshi Matsuo, Atsushi Yukita
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Publication number: 20120170217Abstract: In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.Type: ApplicationFiled: March 14, 2012Publication date: July 5, 2012Applicant: Hitachi, Ltd.Inventors: Fusanori Nishikimi, Kinya Nakatsu
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Patent number: 8212382Abstract: A power conversion apparatus capable of improving the impedance characteristics between each of two power modules and each of a plurality of capacitor cells, the power conversion apparatus including: plural capacitor cells connected in parallel between a three-layer laminated wiring board consisting of a positive polarity conductor board and a negative polarity conductor board formed widely in the direction of the parallel disposition of the power modules and laminated with an insulation sheet therebetween; a three-layer laminated conductor board consisting of a positive polarity conductor board and a negative polarity conductor board formed widely in the direction of the parallel direction of the power modules and laminated with an insulation sheet therebetween and used to connect the positive and negative polarity sides of each of the two power modules to the laminated wiring board respectively.Type: GrantFiled: May 26, 2009Date of Patent: July 3, 2012Assignee: Hitachi, Ltd.Inventors: Kinya Nakatsu, Hideyo Suzuki, Fusanori Nishikimi, Takeshi Matsuo, Atsushi Yukita
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Publication number: 20120087095Abstract: A power module according to the present invention includes: a semiconductor element for converting DC current to AC current by switching operation; an electrical wiring board to which the semiconductor element is electrically connected, with the semiconductor element being disposed upon one of its principal surfaces; an insulating resin layer provided on the other principal surface of the electrical wiring board; a first insulation layer that is disposed opposite from the electrical wiring board, separated by the insulating resin layer, and that is joined to the insulating resin layer; a second insulation layer that is disposed opposite from the insulating resin layer, separated by the first insulation layer, and that ensures electrical insulation of the semiconductor element; and a metallic heat dissipation member that is disposed opposite from the first insulation layer, separated by the second insulation layer, and that radiates heat generated by the semiconductor element via the electrical wiring board, tType: ApplicationFiled: April 16, 2010Publication date: April 12, 2012Applicant: Hitachi Automotive Systems, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Toshiya Satoh, Hideaki Ishikawa
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Publication number: 20120039039Abstract: In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.Type: ApplicationFiled: October 5, 2011Publication date: February 16, 2012Applicant: Hitachi, Ltd.Inventors: Fusanori NISHIKIMI, Kinya Nakatsu
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Publication number: 20120033475Abstract: Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214. A DC positive electrode terminal 532, a DC negative electrode terminal 572, and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.Type: ApplicationFiled: October 13, 2011Publication date: February 9, 2012Applicant: HITACHI, LTD.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito
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Publication number: 20120008280Abstract: The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.Type: ApplicationFiled: September 23, 2011Publication date: January 12, 2012Applicant: Hitachi, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Atushi Kawabata
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Patent number: 8081472Abstract: The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.Type: GrantFiled: March 1, 2010Date of Patent: December 20, 2011Assignee: Hitachi, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Atushi Kawabata
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Publication number: 20110299265Abstract: A power module and a power converter device including the power module include: two base plates with their main surfaces facing each other; a semiconductor circuit unit disposed between the two base plates; a connecting member that is connected to the two base plates and forms a housing region in which the semiconductor circuit unit is housed; and an insulating member that is placed between the base plate and the semiconductor circuit unit and secures electrical insulation of the base plate and the semiconductor circuit unit. A rigidity or thickness of the connecting member is less than a rigidity or thickness of the base plate.Type: ApplicationFiled: October 30, 2009Publication date: December 8, 2011Inventors: Kinya Nakatsu, Hiroshi Hozoji, Takeshi Tokuyama, Yusuke Takagi, Toshiya Satoh, Taku Oyama, Takanori Ninomiya
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Patent number: 8064234Abstract: Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214. A DC positive electrode terminal 532, a DC negative electrode terminal 572, and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.Type: GrantFiled: January 25, 2008Date of Patent: November 22, 2011Assignee: Hitachi, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito
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Publication number: 20110249421Abstract: A power conversion device for a vehicle includes: a power module that includes a switching device and, upon operation of the switching device, converts DC power into AC power to be supplied to an electric machine for driving a vehicle; a capacitor module that includes a smoothing capacitor element, an input-side power source terminal for receiving DC power, and an output-side power source terminal for supplying DC power to the power module; and a noise removal capacitor for removing noise, wherein: the noise removal capacitor is built in the capacitor module, and the noise removal capacitor is electrically connected to the input-side power source terminal in a position where a distance between a connection position of the noise removal capacitor and the input-side power source terminal is less than a distance between a connection position of the noise removal capacitor and the output-side power source terminal of the capacitor module.Type: ApplicationFiled: October 26, 2009Publication date: October 13, 2011Applicant: Hitachi Automotive Systems, Ltd.Inventors: Takeshi Matsuo, Kinya Nakatsu, Toshiya Satoh, Ken Maeda
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Publication number: 20110235270Abstract: The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module. A casing houses: semiconductor modules constituting a main circuit for power conversion; a capacitor electrically connected to the main circuit; drive circuits that provide the main circuit with a drive signal used in power conversion operation; a control circuit that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules are housed inside the cooling chamber, and at least the capacitor and the control circuit are disposed outside the cooling chamber.Type: ApplicationFiled: May 20, 2011Publication date: September 29, 2011Applicant: Hitachi, Ltd.Inventors: Kinya NAKATSU, Takayoshi Nakamura, Ryuichi Saito, Takashi Suga, Hiroki Funato
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Publication number: 20110228479Abstract: An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.Type: ApplicationFiled: June 3, 2011Publication date: September 22, 2011Applicant: Hitachi, Ltd.Inventors: Takeshi TOKUYAMA, Kinya NAKATSU, Ryuichi SAITO, Keisuke HORIUCHI, Toshiya SATOH, Hideki MIYAZAKI
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Publication number: 20110198919Abstract: A circuit board, included in an inverter device that outputs AC current to a motor for driving a vehicle, includes: an insulation layer; a first conductor formed on a first side of the insulation layer, and upon which a semiconductor chip included in a lower arm of an inverter circuit is mounted; a second conductor formed on a second side of the insulation layer opposite to the first side thereof, and connected to a ground of the vehicle; and an inductor connected in parallel with a parasitic capacitance created between the first conductor and the second conductor, thus constituting a parallel resonator together with the parasitic capacitance.Type: ApplicationFiled: February 16, 2011Publication date: August 18, 2011Applicant: Hitachi Cable, Ltd.Inventors: Yukio HATTORI, Kinya Nakatsu
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Patent number: 7978471Abstract: An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.Type: GrantFiled: February 19, 2009Date of Patent: July 12, 2011Assignee: Hitachi, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Keisuke Horiuchi, Toshiya Satoh, Hideki Miyazaki
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Patent number: 7978468Abstract: The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module. A casing houses: semiconductor modules 20, 30 constituting a main circuit for power conversion; a capacitor 50 electrically connected to the main circuit; drive circuits 70, 71 that provide main circuit with a drive signal used in power conversion operation; a control circuit 74 that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage 28 is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material.Type: GrantFiled: March 2, 2010Date of Patent: July 12, 2011Assignee: Hitachi, Ltd.Inventors: Kinya Nakatsu, Takayoshi Nakamura, Ryuichi Saito, Takashi Suga, Hiroki Funato
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Patent number: D651170Type: GrantFiled: January 27, 2010Date of Patent: December 27, 2011Assignee: Hitachi Automotive Systems, Ltd.Inventors: Masashi Yura, Shinichi Fujino, Yusuke Takagi, Toshiya Satoh, Kinya Nakatsu, Takeshi Tokuyama
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Patent number: D651565Type: GrantFiled: January 27, 2010Date of Patent: January 3, 2012Assignee: Hitachi Automotive Systems, Ltd.Inventors: Masashi Yura, Shinichi Fujino, Yusuke Takagi, Toshiya Satoh, Kinya Nakatsu, Takeshi Tokuyama