Abstract: An optical module includes a circuit board, a photoelectric conversion element mounted on the circuit board, an optical connector for optically connecting the photoelectric conversion element and an optical fiber, a semiconductor circuit element mounted on the circuit board and electrically connected to the photoelectric conversion element, a pressing member for pressing and fixing the optical connector to the circuit board, and a supporting member for supporting the pressing member. The supporting member includes a heat-absorbing surface and a heat-dissipating surface. The heat-absorbing surface is thermally connected to the semiconductor circuit element. The heat-dissipating surface dissipates heat of the semiconductor circuit element to be absorbed through the heat-absorbing surface.

Abstract: Thermal connection between a plurality of communication modules and a heatsink placed on these communication modules is securely achieved and maintained. In a signal transmission device in which a common heatsink is arranged on a plurality of communication modules equipped on a board, the signal transmission device has a coil spring provided between the board and the communication modules, and the communication modules are biased toward the heatsink by the coil spring so that an upper surface of the communication module is pressed against a bottom surface of the heatsink.

Abstract: There is provided a photoelectric conversion module that can be mounted two-dimensionally over a device board in a high-density, low-height manner and cooled efficiently with an easy-to-install collective-type radiator. In the photoelectric conversion module mounted over the device board, an optical connector is attached to that surface of an optical subassembly facing the device board. An electric connector has at least two sides thereof opened so that the optical transmission medium is threaded therethrough and extended through at least two facing sides of the optical subassembly. The optical transmission medium is thus extended between the optical subassembly and the device board in a vertically stacked manner.

Abstract: An optical transmission module includes a first member having a bottom portion, sidewalls and an opening, a second member joined to a sidewall end surface of the first member and sealing the opening, a connector member attachable to and detachable from the second member, a light-emitting element mounted on an inner surface of the second member, an interconnection formed on the inner surface and extending inside and outside the first member across the sidewalls of the first member, and electrodes formed on outer surfaces of the sidewalls. The second member transmits therethrough light outputted from the light-emitting element. One end portion of the electrode is electrically connected to one end portion of the interconnection extending outside the first member. The other end of the electrode is soldered to an interconnection formed on a substrate surface on which the optical transmission module is mounted.

Abstract: An optical transmission module includes a first member having a bottom portion, sidewalls and an opening, a second member joined to a sidewall end surface of the first member and sealing the opening, a light-emitting element mounted on an inner surface of the second member, an interconnection formed on the inner surface of the second member and extending inside and outside the first member across the sidewalls of the first member, and electrodes formed on outer surfaces of the sidewalls of the first member. The second member transmits therethrough light outputted from the light-emitting element. One end portion of the electrode is electrically connected to one end portion of the interconnection extending outside the first member. The other end of the electrode is soldered to an interconnection formed on a substrate surface on which the optical transmission module is mounted.

Abstract: A height of a signal transmission device is decreased as low as possible as maintaining or improving a cooling performance for the communication module. Ina signal transmission device provided with a communication module provided on a substrate and a cooling mechanism for cooling the communication module, the cooling mechanism includes: a heat-transfer plate including a first region which overlaps with bottom surfaces of a plurality of the communication modules and is thermally connected to the bottom surfaces and a second region which does not overlap with the bottom surfaces of the communication modules; and a heat-release fin provided in the second region of the heat-transfer plate.

Abstract: To suppress degradation of signals exchanged between the semiconductor chip and each of the communication modules while a large number of communication modules are mounted near a semiconductor chip at a high density. A connector includes a plug connector provided in a communication module and a receptacle connector provided in a motherboard to which the connection module is connected. The plug connector has an inserting convex portion that is connected to a module substrate included in the communication module. The receptacle connector has an inserting concave portion into which the inserting convex portion is inserted. A plurality of first connection terminals are arranged in two outer side surfaces in parallel with each other, of the inserting convex portion. A plurality of second connection terminals in contact with the first connection terminals are arranged in two inner side surfaces in parallel with each other, of the inserting concave portion.

Abstract: The present invention achieves a way of mounting plural optical modules onto a wiring board more simply and more densely. There is provided an optical module assembly for mounting plural optical modules onto a wiring board. The optical module assembly includes the optical modules to which optical wiring has been connected and a module case to accommodate the optical modules. The optical modules and the module case are unified. The module case is provided with a floating mechanism for making the optical modules floating, when accommodated therein. The floating mechanism is comprised of plate springs or the like.

Abstract: A connector is configured of a plug connector and a receptacle connector. The plug connector has an insertion convex portion including: a first sidewall portion and a second sidewall portion that are in parallel with each other and a plurality of first connection terminals provided on the sidewall portions. The receptacle connector has an insertion concave portion to which the insertion convex portion is inserted and in which a plurality of second connection terminals that are contacted with the first connection terminals are provided. The respective inner side surfaces of the first sidewall portion and the second sidewall portion face each other across a space, and the plurality of first connection terminals are arranged on the respective outer side surfaces of the first sidewall portion and the second sidewall portion.

Abstract: To efficiently cool an IC chip and a transmission module disposed on the same substrate, amounting structure of transmission module of the present invention includes a motherboard, a package substrate mounted on the motherboard, an IC chip and a plurality of connectors disposed on amounting surface of the package substrate, a plurality of transmission modules connected to the plurality of connectors, and module cooling members having a plurality of slits provided along an connector array direction. The connectors are disposed inside the slits of module cooling members, and the transmission modules can be connected to and disconnected from the connectors disposed through the slits. The transmission modules connected to the connectors are in contact with inside surfaces of the slits and thermally connected to the cooling members.

Abstract: A connector includes a plug connector and a receptacle connector. The plug connector has an insertion convex portion including: an end surface; outer side surfaces facing in parallel to each other across the end surface; and a first tapered surface connecting each outer side surface and the end surface. The receptacle connector has an insertion concave portion including: an insertion port; inner side surfaces facing in parallel to each other across the insertion port; and a second tapered surface connecting each inner side surface and an edge of the insertion port. The outer side surfaces of the insertion convex portion have first connection terminals arranged, the inner side surfaces of the insertion concave portion have second connection terminals arranged in contact with the first contact terminals, and the first tapered surface has a width twice as large as a width of the second tapered surface or larger.

Abstract: An optical fiber connecter includes a first holding member including a positioning groove to position the optical fiber in a direction orthogonal to a longitudinal direction of the optical fiber, a second holding member including an accommodating groove including a substantially flat bottom surface and accommodating the optical fiber movably in the direction orthogonal to the longitudinal direction, the second holding member being configured such that the optical fiber is pressed against the positioning groove of the first holding member thereby, and a fixing member to fix the optical fiber to the accommodating groove of the second holding member at a position being away in a drawing direction of the optical fiber from an end of the positioning groove in the drawing direction.

Abstract: An optical communication module is composed of a photoelectric conversion element to transduce an optical signal into an electrical signal or an electrical signal into an optical signal, an optical fiber including an end and being optically coupled to the photoelectric conversion element, a receiving member including an outer surface and receiving the end of the optical fiber and the photoelectric conversion element, and a plurality of electrodes protruded from the outer surface of the receiving member and aligned in a straight line. The optical fiber is drawn from the outer surface of the receiving member and in an oblique direction relative to a direction of the alignment of the plurality of electrodes.

Abstract: An optical module includes a photoelectric conversion element optically connected to an optical fiber, a plate-shaped substrate mounting the photoelectric conversion element, coupling members fixed to both end portions of the substrate so as to sandwich the photoelectric conversion element, and a cover member coupled to the substrate by the coupling members so as to cover at least a portion of the substrate.

Abstract: To efficiently cool an IC chip and a transmission module disposed on the same substrate, amounting structure of transmission module of the present invention includes a motherboard, a package substrate mounted on the motherboard, an IC chip and a plurality of connectors disposed on amounting surface of the package substrate, a plurality of transmission modules connected to the plurality of connectors, and module cooling members having a plurality of slits provided along an connector array direction. The connectors are disposed inside the slits of module cooling members, and the transmission modules can be connected to and disconnected from the connectors disposed through the slits. The transmission modules connected to the connectors are in contact with inside surfaces of the slits and thermally connected to the cooling members.

Abstract: There is provided a photoelectric conversion module that can be mounted two-dimensionally over a device board in a high-density, low-height manner and cooled efficiently with an easy-to-install collective-type radiator. In the photoelectric conversion module mounted over the device board, an optical connector is attached to that surface of an optical subassembly facing the device board. An electric connector has at least two sides thereof opened so that the optical transmission medium is threaded therethrough and extended through at least two facing sides of the optical subassembly. The optical transmission medium is thus extended between the optical subassembly and the device board in a vertically stacked manner.

Abstract: An optical communication module includes an optical element array, a supporting member on which the optical element array is placed, an optical member for optically coupling the optical element array and a plurality of optical fibers together, a plurality of grooves provided in the supporting member or the optical member, and a plurality of protrusions provided on the optical member or the supporting member in correspondence with the grooves respectively. The grooves and the protrusions are mated together. The grooves are provided as being widened toward their openings. The grooves and the protrusions are each provided so that a location in a width direction at which no relative locational misalignment occurs therebetween lies on a line through the center of the optical element array. The grooves and the protrusions are each provided on at least two or more different lines through the center of the optical element array.

Abstract: A first terminal notifies an LFC service functional unit of LFC package related information for customization of a second terminal, an address of the second terminal to be customized, and an account of the user of the first terminal to a contents provider. As a result, the LFC service functional unit acquires an LFC package from the contents provider, then the LFC service functional unit customizes the second terminal based on the obtained LFC package.

Abstract: Thermal connection between a plurality of communication modules and a heatsink placed on these communication modules is securely achieved and maintained. In a signal transmission device in which a common heatsink is arranged on a plurality of communication modules equipped on a board, the signal transmission device has a coil spring provided between the board and the communication modules, and the communication modules are biased toward the heatsink by the coil spring so that an upper surface of the communication module is pressed against a bottom surface of the heatsink.

Abstract: A height of a signal transmission device is decreased as low as possible as maintaining or improving a cooling performance for the communication module. Ina signal transmission device provided with a communication module provided on a substrate and a cooling mechanism for cooling the communication module, the cooling mechanism includes: a heat-transfer plate including a first region which overlaps with bottom surfaces of a plurality of the communication modules and is thermally connected to the bottom surfaces and a second region which does not overlap with the bottom surfaces of the communication modules; and a heat-release fin provided in the second region of the heat-transfer plate.