Abstract: A heat sink having a very high heat transfer capability may be made from a plurality of unit elements. Each unit element includes a series of inlet tubes having a range of diameters and a series of outlet tubes also having a range of diameters. At least one inlet tube having a minimum inlet tube diameter may be in flow communication with at least one outlet tube having a minimum outlet tube diameter.

Abstract: A display (200) that includes a first screen layer (205) having a first dimension (230) and a second screen layer (210) having a first side (211) bonded to a first side (206) of the first screen layer. The second screen layer can have a second dimension (225) that is greater than the first dimension, thereby defining a portion (235) of the second layer that extends beyond the first layer. The display also can include at least one integrated circuit chip (245) attached to the portion of the second layer. The integrated circuit chip can include, for example, a display driver. A stiffening component (250) can be positioned, at least in part, over the integrated circuit chip. The stiffening component also can be positioned over at least a substantial part of the defined portion of the second layer.

Abstract: A device housing (105) and a method (500) of manufacturing the same. The method can include positioning within a mold (300) an insert (205) of thermally conductive film (210). For example, graphite film can be positioned within the mold. The graphite film can have a first thermal conductivity in an in-plane direction (215) and a second thermal conductivity in a normal direction (220) that is less than one-tenth the first thermal conductivity. For example, the graphite film can have a first thermal conductivity in an in-plane direction that is greater than about 150 W/m-K and a second thermal conductivity in a normal direction that is less than 15 W/m-K. An electronic circuit (400) including at least one thermal energy generator (405) can be positioned into the device housing. The thermal energy generator can be positioned proximate to the insert of thermally conductive film.

Abstract: A method (50) of forming a solder mask on a portion of a module (40) using for example LTCC technology includes the steps of forming (52) a multilayered ceramic substrate (20) with exposed metallization forming solder pads (28 or 31), masking (54 or 56) the solder pads by placing an additional ceramic layer (22 or 32) on the substrate that at least covers at least a portion of periphery of the solder pad using the LTCC process. The method can further include applying (58 or 60) solder (36) to a portion of the solder pad not covered by the solder mask (22) and placing a printed circuit board (34) having a different coefficient of thermal expansion than the multilayer ceramic substrate on the multilayer ceramic substrate to form the module before reflowing. The module can then be reflowed to form the module without cracks.

Abstract: The tip electrode member has a rounded or bullet shaped distal end and has grooves etched into the distal end to increase the surface area of the electrode member within a small displaced surface area to minimize polarization of the tip electrode member while ensuring sufficient electric current flow to cause heart muscle depolarization. Preferably, the tip electrode member is made of titanium or a titanium alloy and is coated with carbon.

Abstract: The implantable pulse generator herein may take the form of a cardiac pacer. The generator includes a pulse generator circuit including passive and active chips. These are mounted on a chip carrier with the active chips located in a hermetically sealed cavity in one major surface of the carrier and the passive chips are mounted on the other major surface. Conductive means internally of the carrier provide electrical paths interconnecting the active and passive chips.

Abstract: The human implantable pulse generator herein may serve as a cardiac pacer. The housing for the generator is minimized in size by mounting integrated circuit chips, forming the pulse generator circuit, in a hermetically sealed cavity in a chip carrier.

Abstract: The electrochemical cell comprises an outer conductive housing, an anode material within the housing, a cathode material within the housing, and porous insulating means separating the anode material from the cathode material, and an electrolyte inside the housing and within the porous insulating means. The cathode material is a mixture of a metallic halogen compound and a metallic sulfide compound less electrochemically reactive with the anode material than the metallic halogen compound.

Abstract: A first thin-film resistor member, preferably TaN, is disposed over a sec thin film member, such as NiCr, to completely cover the second member and act as a passivating layer preventing anodization of the second. The thin-film materials used for the first and second members have substantially an equal thin-film, sheet-resistance, resistance value per square (.OMEGA..quadrature.), with the first material being trimmable for this purpose. Also, the TCR (temperature coefficient of expansion) of the first material is negative while that of the second is positive. These members are coupled in parallel with substantially equal lengths but with differing widths which permit the first to completely cover the second. The arrangement permits the TCR of the parallel circuit to be brought substantially to a zero value and, in any event, a value no greater than .+-. 50 ppm/.degree. C.