Patents by Inventor Kip C. Killpack

Kip C. Killpack has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10198333
    Abstract: An apparatus and method is described herein for providing a test, validation, and debug architecture. At a target or base level, hardware hooks (Design for Test or DFx) are designed into and integrated with silicon parts. A controller may provide abstracted access to such hooks, such as through an abstraction layer that abstracts low level details of the hardware DFx. In addition, the abstraction layer through an interface, such as APIs, provides services, routines, and data structures to higher-level software/presentation layers, which are able to collect test data for validation and debug of a unit/platform under test. Moreover, the architecture potentially provides tiered (multiple levels of) secure access to the test architecture. Additionally, physical access to the test architecture for a platform may be simplified through use of a unified, bi-directional test access port, while also potentially allowing remote access to perform remote test and debug of a part/platform under test.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: February 5, 2019
    Assignee: INTEL CORPORATION
    Inventors: Mark B. Trobough, Keshavan K. Tiruvallur, Chinna B. Prudvi, Christian E. Iovin, David W. Grawrock, Jay J. Nejedlo, Ashok N. Kabadi, Travis K. Goff, Evan J. Halprin, Kapila B. Udawatta, Jiun Long Foo, Wee Hoo Cheah, Vui Yong Liew, Selvakumar Raja Gopal, Yuen Tat Lee, Samie B. Samaan, Kip C. Killpack, Neil Dobler, Nagib Z. Hakim, Brian Meyer, William H. Penner, John L. Baudrexl, Russell J. Wunderlich, James J. Grealish, Kyle Markley, Timothy S. Storey, Loren J. McConnell, Lyle E. Cool, Mukesh Kataria, Rahima K. Mohammed, Tieyu Zheng, Yi Amy Xia, Ridvan A. Sahan, Arun R. Ramadorai, Priyadarsan Patra, Edwin E. Parks, Abhijit Davare, Padmakumar Gopal, Bruce Querbach, Hermann W. Gartler, Keith Drescher, Sanjay S. Salem, David C. Florey
  • Publication number: 20170336918
    Abstract: Devices for sensing touch on a surface using a minimum depth-value surface characterization, including associated methods, are disclosed and described.
    Type: Application
    Filed: May 22, 2016
    Publication date: November 23, 2017
    Applicant: Intel Corporation
    Inventors: David R. Holman, Kip C. Killpack, Brandon Gavino, Vinay K. Nooji, Abhay A. Dharmadhikari, Vijay M. Rao
  • Patent number: 9609242
    Abstract: A depth-sensing camera may be used to locate objects on a planar surface. A planar fit calculation is used to model the surface. One problem with the best planar fit calculation is that it is not robust over time. Firstly, this is because the depth data has a non-linear curve near its extremities because of camera lens distortion. Secondly, as the depth-sensing camera warms up and its thermal activity changes, the depth data drifts and the initial plane fit is no longer valid. The position and the amount of curvature and drift may be different for cameras of the same make and model in some cases. In accordance with some embodiments, algorithms may be used to detect and correct for these types of errors to support more robust plane fitting in real time.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: March 28, 2017
    Assignee: Intel Corporation
    Inventors: Kip C. Killpack, David R. Holman, Abhay A. Dharmadhikari, Brandon Gavino, Vinay K. Nooji, Katie R. Hauser, Lauren M. Lieu
  • Publication number: 20160381309
    Abstract: A depth-sensing camera may be used to locate objects on a planar surface. A planar fit calculation is used to model the surface. One problem with the best planar fit calculation is that it is not robust over time. Firstly, this is because the depth data has a non-linear curve near its extremities because of camera lens distortion. Secondly, as the depth-sensing camera warms up and its thermal activity changes, the depth data drifts and the initial plane fit is no longer valid. The position and the amount of curvature and drift may be different for cameras of the same make and model in some cases. In accordance with some embodiments, algorithms may be used to detect and correct for these types of errors to support more robust plane fitting in real time.
    Type: Application
    Filed: June 25, 2015
    Publication date: December 29, 2016
    Inventors: Kip C. Killpack, David R. Holman, Abhay A. Dharmadhikari, Brandon Gavino, Vinay K. Nooji, Katie R. Hauser, Lauren M. Lieu
  • Publication number: 20150127983
    Abstract: An apparatus and method is described herein for providing a test, validation, and debug architecture. At a target or base level, hardware (Design for Test or DFx) are designed into and integrated with silicon parts. A controller may provide abstracted access to such hooks, such as through an abstraction layer that abstracts low level details of the hardware DFx. In addition, the abstraction layer through an interface, such as APIs, provides services, routines, and data structures to higher-level software/presentation layers, which are able to collect test data for validation and debug of a unit/platform under test. Moreover, the architecture potentially provides tiered (multiple levels of) secure access to the test architecture. Additionally, physical access to the test architecture for a platform may be simplified through use of a unified, bi-directional test access port, while also potentially allowing remote access to perform remote test and de-bug of a part/platform under test.
    Type: Application
    Filed: December 23, 2010
    Publication date: May 7, 2015
    Applicant: INTEL CORPORATION
    Inventors: Mark B. Trobough, Keshavan K. Tiruvallur, Chinna B. Prudvi, Christian E. Iovin, David W. Grawrock, Jay J. Nejedlo, Ashok N. Kabadi, Travis K. Goff, Evan J. Halprin, Kapila B. Udawatta, Jiun Long Foo, Wee Hoo Cheah, Vui Yong Liew, Selvakumar Raja Gopal, Yuen Tat Lee, Samie B. Samaan, Kip C. Killpack, Neil Dobler, Nagib Z. Hakim, Briar Meyer, William H. Penner, John L. Baudrexl, Russell J. Wunderlich, James J. Grealish, Kyle Markley, Timothy S. Storey, Loren J. McConnell, Lyle E. Cool, Mukesh Kataria, Rahima K. Mohammed, Tieyu Zheng, Yi Amy Xia, Ridvan A. Sahan, Arun R. Ramadorai, Priyadarsan Patra, Edwin E. Parks, Abhijit Davare, Padmakumar Gopal, Bruce Querbach, Hermann W. Gartler, Keith Drescher, Sanjay S. Salem, David C. Florey