Patents by Inventor Kipling Yeh

Kipling Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9214373
    Abstract: A chuck includes a number of gas openings positioned to provide a gas flow to a backside of a wafer secured to the chuck. The chuck also includes a number of exhaust openings positioned to exhaust the gas at a distance from a topside edge of the wafer such that adverse thermal effects on the edge are reduced to a predetermined level.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: December 15, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Hao Hsu, Kipling Yeh, Chia-Ching Huang
  • Publication number: 20140042715
    Abstract: A chuck includes a number of gas openings positioned to provide a gas flow to a backside of a wafer secured to the chuck. The chuck also includes a number of exhaust openings positioned to exhaust the gas at a distance from a topside edge of the wafer such that adverse thermal effects on the edge are reduced to a predetermined level.
    Type: Application
    Filed: August 8, 2012
    Publication date: February 13, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Hao Hsu, Kipling Yeh, Chia-Ching Huang